The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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![]() | Mfr Part No M7A3P1000-FGG484 | Microchip Technology | Datasheet | 2145 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M7A3P1000 | 350 MHz | 60 | MICROSEMI CORP | M7A3P1000-FGG484 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-1FG256 | Microchip Technology | Datasheet | 2088 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS1500 | 90 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.28205 GHz | 1 | 38400 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-2FGG896 | Microchip Technology | Datasheet | 704 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 870 MHz | 27 | MICROSEMI CORP | AX2000-2FGG896 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 586 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX2000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 870 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 36 kB | 740 ps | 740 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 870 MHz | 32256 | 21504 | 2 | 21504 | 0.74 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||
![]() | Mfr Part No A3P1000-1FG256M | Microchip Technology | Datasheet | 2312 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55 to 125 °C | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-2FG256 | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 400000 | 400000 | 90 | MICROSEMI CORP | M1A3P400-2FG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-BG272 | Microchip Technology | Datasheet | 2230 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 73 MHz | 40 | MICROSEMI CORP | A42MX36-BG272 | 131 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 202 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | 30 | 5.19 | N | No | 5.25 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A42MX36 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 131 MHz | 1184 | 1822 | 2.7 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-FG144M | Microchip Technology | Datasheet | 2289 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e0 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX08A-1TQG100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | A54SX08 | 278 MHz | 90 | MICROSEMI CORP | A54SX08A-1TQG100 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 81 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | A54SX08A | e3 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 127 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 127 | 768 CLBS, 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 12000 | 768 | 1.1 ns | 768 | 768 | 12000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-1FGG676I | Microchip Technology | Datasheet | 2020 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-1FGG676I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL090T-1FGG676 | Microchip Technology | Datasheet | 1695 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-676 | 676 | 676-FBGA (27x27) | M2GL090 | 40 | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 425 I/O | 86184 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 1.2000 V | 0 to 85 °C | Tray | M2GL090T | 85 °C | 0 °C | 1.14V ~ 2.625V | 1.2 V | 323.3 kB | 86316 | 2648064 | 1 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL010TS-1VF256I | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL010 | 119 | MICROSEMI CORP | M2GL010TS-1VF256I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 138 I/O | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 0.80 MM PITCH, VFBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL010TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-2FG896I | Microchip Technology | Datasheet | 519 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 870 MHz | 27 | MICROSEMI CORP | AX2000-2FG896I | 870 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX2000 | e0 | TIN LEAD | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 740 ps | 740 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 870 MHz | 32256 | 21504 | 2 | 21504 | 0.74 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||
![]() | Mfr Part No AFS600-2FG256 | Microchip Technology | Datasheet | 1815 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-2FG484 | Microchip Technology | Datasheet | 1720 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS600 | 60 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-2FGG484I | Microchip Technology | Datasheet | 1913 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FGG484I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P250-2FG144 | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P250 | 350 MHz | 160 | MICROSEMI CORP | M1A3P250-2FG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-1FG256I | Microchip Technology | Datasheet | 1717 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-2FGG676 | Microchip Technology | Datasheet | 2070 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-2FGG676 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-1FGG256K | Microchip Technology | Datasheet | 2056 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | AFS600 | 90 | Microchip Technology | Yes | 119 | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS600 | 100 °C | -55 °C | 1.425V ~ 1.575V | 13.5 kB | 110592 | 600000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL090-FCSG325I | Microchip Technology | Datasheet | 1871 |
| Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-FCSG325I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC | , BGA325,21X21,20 | BGA325,21X21,20 | Active | Active | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | compliant | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 |
M7A3P1000-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS1500-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
290.899572
AX2000-2FGG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,107.275811
A3P1000-1FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A42MX36-BG272
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
525.891388
M1A3P1000-FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A54SX08A-1TQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3PE1500-1FGG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL090T-1FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL010TS-1VF256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX2000-2FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,666.246188
AFS600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
299.274015
AFS600-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
254.532343
M1A3PE1500-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P250-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS600-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
481.775492
M1A3PE1500-2FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
368.507011
M2GL090-FCSG325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
196.791884
