The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No AFS600-1FGG256K | Microchip Technology | Datasheet | 2056 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | AFS600 | 90 | Microchip Technology | Yes | 119 | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS600 | 100 °C | -55 °C | 1.425V ~ 1.575V | 13.5 kB | 110592 | 600000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2FGG484I | Microchip Technology | Datasheet | 1913 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FGG484I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-2FG144 | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P250 | 350 MHz | 160 | MICROSEMI CORP | M1A3P250-2FG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL250V5-FG144 | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL250 | 108 MHz | 160 | MICROSEMI CORP | M1AGL250V5-FG144 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M1AGL250V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-1PQG208 | Microchip Technology | Datasheet | 31 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P600 | 350 MHz | 24 | MICROSEMI CORP | M1A3P600-1PQG208 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 154 I/O | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P600 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-1FGG144I | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 160 | MICROSEMI CORP | M1A3P600-1FGG144I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-2VQG100 | Microchip Technology | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | VQFP | 100-VQFP (14x14) | M1A3P250 | 90 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 68 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | 2 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2FG484 | Microchip Technology | Datasheet | 2261 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 280 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3PE1500 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF500T-1FCG1152E | Microchip Technology | Datasheet | 587 |
| Min: 1 Mult: 1 | Surface Mount | BGA-1152 | 1152-FCBGA (35x35) | MPF500 | 1 | MICROSEMI CORP | MPF500T-1FCG1152E | Microchip Technology | Yes | SMD/SMT | 584 | Tray | Active | Active | 5.77 | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF500T | 0.97V ~ 1.08V | compliant | 1.05 V | FIELD PROGRAMMABLE GATE ARRAY | 481000 | 33792000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA600-FG676I | Microchip Technology | Datasheet | 772 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA | 676 | 676-FBGA (27x27) | 400.011771 mg | APA600 | 40 | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | SMD/SMT | 454 I/O | Tray | Active | N | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 2.5000 V | 0.014110 oz | -40 to 85 °C | Tray | APA600 | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-BGG272M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 73 MHz | 40 | MICROSEMI CORP | A42MX36-BGG272M | 131 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 202 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | ROHS COMPLIANT, PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | Obsolete | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX36 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 131 MHz | 1184 | 1822 | 2.7 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-2BGG272 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 91 MHz | 40 | MICROSEMI CORP | A42MX36-2BGG272 | 164 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 202 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Obsolete | 40 | 5.26 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A42MX36 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1VQ100 | Microchip Technology | Datasheet | 799 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | 71 | 1536 | A3P060 | 350 MHz | 60000 | 90 | ProASIC®3 | MICROSEMI CORP | A3P060-1VQ100 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 71 I/O | 60000 | 1.575(V) | 1.425(V) | 1.5(V) | 0C to 85C | 85C | 0C | Commercial | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | VQFP | Active | 130NM | Active | Yes | No | 30 | 5.22 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 272(MHz) | 100 | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FG896 | Microchip Technology | Datasheet | 800 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3PE3000L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FG484 | Microchip Technology | Datasheet | 2368 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | P1AFS1500 | 60 | Microchip Technology | Yes | 223 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005S-VFG256 | Microchip Technology | Datasheet | 23 | - | Min: 1 Mult: 1 | Surface Mount | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2GL005 | 119 | MICROSEMI CORP | M2GL005S-VFG256 | Microchip Technology | Yes | 3 | 161 | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL005S | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | S-PBGA-B256 | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-2FG324I | Microchip Technology | Datasheet | 758 | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | M1A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | M1A3PE3000-2FG324I | Microchip Technology | Yes | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-FG256A | Microchip Technology | Datasheet | 1833 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A54SX32 | 90 | 238 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 203 I/O | Tray | Active | N | 2.75 V | 2.25 V | Actel | 0.014110 oz | -40°C ~ 125°C (TA) | Tray | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-FBGG272 | Microchip Technology | Datasheet | 2264 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 44 MHz | 40 | MICROSEMI CORP | A42MX36-FBGG272 | 79 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 202 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | ROHS COMPLIANT, PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | Obsolete | 40 | 5.25 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A42MX36 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 79 MHz | 1184 | 1822 | 3.8 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG896I | Microchip Technology | Datasheet | 785 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-896 | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 504 kbit | 27 | MICROSEMI CORP | M1A3PE3000L-1FGG896I | 350 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | 3 | SMD/SMT | 620 I/O | 3500 LAB | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 25 mA | 700 Mb/s | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm |
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AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
368.507011
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M1A3PE1500-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL250V5-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1A3P600-1PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-2VQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
25.509708
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M1A3PE1500-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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MPF500T-1FCG1152E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
601.876049
-
APA600-FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,591.219604
-
A42MX36-BGG272M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX36-2BGG272
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1VQ100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1FG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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P1AFS1500-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
323.416410
-
M2GL005S-VFG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-2FG324I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX32A-FG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
408.083018
-
A42MX36-FBGG272
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
430.037216
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M1A3PE3000L-1FGG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire