The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No A40MX02-2PLG44 | Microchip Technology | Datasheet | 31 |
| Min: 1 Mult: 1 | Surface Mount | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | A40MX02 | 101 MHz | 27 | MICROSEMI CORP | A40MX02-2PLG44 | 175 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 34 I/O | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-44 | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.084185 oz | 0°C ~ 70°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-1FGG484 | Microchip Technology | Datasheet | 2315 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-1FGG484 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 270 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 272 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-1FGG896I | Microchip Technology | Datasheet | 540 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FGG896I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG144A | Microchip Technology | Datasheet | 1676 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA450 | 160 | MICROSEMI CORP | APA450-FGG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.59 | Details | Yes | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 13.5 kB | 100 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF100TS-FCSG325I | Microchip Technology | Datasheet | 757 |
| Min: 1 Mult: 1 | Surface Mount | BGA-325 | 325-FCBGA (11x11) | MPF100 | 7.6 Mbit | 1 | Microchip Technology | Yes | SMD/SMT | - | 170 | 109000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF100TS | 0.97V ~ 1.08V | 109000 | 7600Kbit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FGG896 | Microchip Technology | Datasheet | 593 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FGG896 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 642 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0.014110 oz | 0 to 70 °C | Tray | APA1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | 896 | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 24.8 kB | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 180 MHz | STD | 56320 | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||
![]() | Mfr Part No A40MX02-1VQG80M | Microchip Technology | Datasheet | 2342 |
| Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 80-VQFP (14x14) | 80 | A40MX02 | 92 MHz | 90 | MICROSEMI CORP | A40MX02-1VQG80M | 160 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 57 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | TQFP | TQFP, | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.65 mm | compliant | S-PQFP-G80 | Not Qualified | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.3 ns | 295 | 3000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-FGG896I | Microchip Technology | Datasheet | 441 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FGG896I | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX2000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||
![]() | Mfr Part No A54SX72A-1FGG256I | Microchip Technology | Datasheet | 1620 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FGG256I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-FG484 | Microchip Technology | Datasheet | 1838 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FG484 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | ||||||||||||||||||||
![]() | Mfr Part No M1AFS600-FGG256I | Microchip Technology | Datasheet | 2208 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-FGG256I | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No A54SX16P-PQG208I | Microchip Technology | Datasheet | 1641 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A54SX16 | 240 MHz | 24 | MICROSEMI CORP | A54SX16P-PQG208I | 240 MHz | 3.63, 5.5 V | + 85 C | Microchip Technology | 2.97, 4.5 V | - 40 C | Yes | 3 | SMD/SMT | 175 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 3.6 V | 3 V | 3.3 V | Actel | 3.3, 5 V | -40 to 85 °C | Tray | A54SX16P | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | Not Qualified | 3.3 V, 5 V | 3.3,3.3/5 V | INDUSTRIAL | 175 | 1452 CLBS, 16000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | STD | 0.9 ns | 1452 | 1452 | 16000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF300T-FCSG536I | Microchip Technology | Datasheet | 1756 |
| Min: 1 Mult: 1 | Surface Mount | BGA-536 | 536-CSPBGA (16x16) | MPF300 | 1 | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 300 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | 20.6 Mbit | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-FG896I | Microchip Technology | Datasheet | 487 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | A3PE3000L-FG896I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||
![]() | Mfr Part No A3PE3000-2FGG484 | Microchip Technology | Datasheet | 469 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000-2FGG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600L-FGG484I | Microchip Technology | Datasheet | 1913 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-FGG484I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FG896A | Microchip Technology | Datasheet | 525 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | APA1000 | 27 | MICROSEMI CORP | APA1000-FG896A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 642 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA1000 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 642 | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-1FG256M | Microchip Technology | Datasheet | 527 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-1CQ208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | A54SX32 | 278 MHz | 1 | MICROSEMI CORP | A54SX32A-1CQ208 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 174 I/O | 70 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 5.23 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0°C ~ 70°C (TA) | A54SX32A | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | unknown | S-CQFP-F208 | 174 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 174 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX24-PLG84M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PLCC-84 | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | A42MX24 | 16 | MICROSEMI CORP | A42MX24-PLG84M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 72 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.239083 oz | -55°C ~ 125°C (TC) | Tube | A42MX24 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 3.3 V, 5 V | MILITARY | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | No |
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