The manufacturer is 'Microchip'
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- All Manufacturers:
Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No AT40K20AL-1BQU | Microchip Technology | Datasheet | 36 |
| Min: 1 Mult: 1 | 8 Weeks | Tin | Surface Mount | Surface Mount | 144-LQFP | 144 | 114 | 0°C~70°C TC | Tray | 1997 | AT40KAL | e3 | yes | Active | 3 (168 Hours) | 144 | 3V~3.6V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100MHz | 40 | AT40K20 | 256 | Not Qualified | 3.3V | 1kB | 1kB | FIELD PROGRAMMABLE GATE ARRAY | 1024 | 8192 | 30000 | 1 | 1520 | 2.2 ns | 20000 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P600-2FGG484I | Microchip Technology | Datasheet | 2365 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | 60 | MICROSEMI CORP | A3P600-2FGG484I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 310 MHz | 2 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-1BG272I | Microchip Technology | Datasheet | 648 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 83 MHz | 40 | MICROSEMI CORP | A42MX36-1BG272I | 151 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 202 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | BGA | Active | 30 | 5.19 | N | No | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A42MX36 | e0 | TIN LEAD SILVER | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF200T-FCSG536E | Microchip Technology | Datasheet | 1793 |
| Min: 1 Mult: 1 | Surface Mount | BGA-536 | 536-CSPBGA (16x16) | MPF200 | 1 | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 300 I/O | 192000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF200T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 192000 | 13619200 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16P-PQG208M | Microchip Technology | Datasheet | 513 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | 175 | 528 | A54SX16 | 207 MHz | 24000 | 24 | SX | MICROSEMI CORP | 924 | A54SX16P-PQG208M | 240 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | Surface Mount | SMD/SMT | 175 I/O | 1452 | 16000 | 3.6/5.25(V) | 3/4.75(V) | 3.3/5(V) | -55C to 125C | 125C | -55C | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | PQFP | Active | 0.35um | Active | Yes | No | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 3.6 V | 3 V | Actel | -55°C ~ 125°C (TC) | Tray | A54SX16P | 3A001.A.2.C | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 0.5 mm | compliant | 240(MHz) | 208 | S-PQFP-G208 | 175 | Not Qualified | 3.3 V, 5 V | 3.3,3.3/5 V | MILITARY | 175 | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 1452 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN015-1QNG68 | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-1QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | OTHER | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 1 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF100TL-FCG484E | Microchip Technology | Datasheet | 1756 |
| Min: 1 Mult: 1 | Surface Mount | BGA-484 | 484-FPBGA (19x19) | MPF100 | 7.6 Mbit | 1 | Microchip Technology | Yes | SMD/SMT | 244 | 109000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF100TL | 0.97V ~ 1.08V | 109000 | 7782400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF200T-FCG784E | Microchip Technology | Datasheet | 2003 |
| Min: 1 Mult: 1 | Surface Mount | BGA-784 | 784-FCBGA (29x29) | MPF200 | 1 | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 364 I/O | 192000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF200T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 192000 | 13619200 | 16 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA600-FG256A | Microchip Technology | Datasheet | 729 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | APA600 | 90 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA600 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300T-FCSG536E | Microchip Technology | Datasheet | 2360 |
| Min: 1 Mult: 1 | Surface Mount | BGA-536 | 536-CSPBGA (16x16) | MPF300 | 1 | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 300 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | 20.6 Mbit | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF300T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF100TL-FCSG325E | Microchip Technology | Datasheet | 1618 |
| Min: 1 Mult: 1 | Surface Mount | BGA-325 | 325-FCBGA (11x11) | MPF100 | 7.6 Mbit | 1 | Microchip Technology | Yes | SMD/SMT | 170 | 109000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF100TL | 0.97V ~ 1.08V | 109000 | 7782400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08A-TQG100A | Microchip Technology | Datasheet | 2399 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | 100-TQFP (14x14) | A54SX08 | 90 | 238 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 81 I/O | Tray | Active | Details | 2.75 V | 2.25 V | Actel | 0.023175 oz | -40°C ~ 125°C (TA) | Tray | A54SX08A | 2.25V ~ 5.25V | 2.5 V | 12000 | 768 | STD | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA450-FGG144 | Microchip Technology | Datasheet | 1930 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA450 | 180 MHz | 160 | MICROSEMI CORP | APA450-FGG144 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 100 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | 180 MHz | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 13.5 kB | 100 | 450000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TS-1FCVG484I | Microchip Technology | Datasheet | 665 |
| Min: 1 Mult: 1 | Surface Mount | BGA-484 | 484-FCBGA (19x19) | MPF300 | 1 | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 284 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 20.6 Mbit | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FGG324 | Microchip Technology | Datasheet | 596 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | 84 | MICROSEMI CORP | A3PE3000L-1FGG324 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 221 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FG676I | Microchip Technology | Datasheet | 497 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FG676I | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 418 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B676 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FGG144I | Microchip Technology | Datasheet | 16 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | A3P060 | 160 | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 96 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 1 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-3PQG208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A42MX36 | 100 MHz | 24 | MICROSEMI CORP | A42MX36-3PQG208I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 176 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | ROHS COMPLIANT, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A42MX36 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TL-FCG1152I | Microchip Technology | Datasheet | 2296 |
| Min: 1 Mult: 1 | Surface Mount | BGA-1152 | 1152-FCBGA (35x35) | MPF300 | 1 | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 512 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 20.6 Mbit | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300TL | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-0054302QYC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 5962-0054302 | 1 | MICROSEMI CORP | 5962-0054302QYC | 250 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 171 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | Active | 5.3 | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Military grade | -55°C ~ 125°C (TJ) | SX-A | e4 | 3A001.A.2.C | GOLD | 125 °C | -55 °C | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | 250 MHz | S-CQFP-F208 | Qualified | 2.5 V | MILITARY | 2.75 V | 2.25 V | 1.3 ns | 1.3 ns | 72000 GATES | 3.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 4024 | 108000 | 250 MHz | 6036 | MIL-PRF-38535 Class Q | 6036 | 1 | 4024 | 72000 | 29.21 mm | 29.21 mm | No |
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AT40K20AL-1BQU
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
42.250178
-
A3P600-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
140.542190
-
A42MX36-1BG272I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
679.886124
-
MPF200T-FCSG536E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
383.492657
-
A54SX16P-PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,247.338225
-
A3PN015-1QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.988439
-
MPF100TL-FCG484E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
366.060622
-
MPF200T-FCG784E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
454.661443
-
APA600-FG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
560.453921
-
MPF300T-FCSG536E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
474.453438
-
MPF100TL-FCSG325E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
475.608330
-
A54SX08A-TQG100A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
169.201513
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APA450-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
230.853424
-
MPF300TS-1FCVG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,055.109915
-
A3PE3000L-1FGG324
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX1000-FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
786.064315
-
A3P060-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A42MX36-3PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
MPF300TL-FCG1152I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
450.306783
-
5962-0054302QYC
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire