The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No A54SX16P-1PQG208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A54SX16 | 241 MHz | 24 | MICROSEMI CORP | A54SX16P-1PQG208M | 280 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 175 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Active | Active | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 3.6 V | 3 V | Actel | -55°C ~ 125°C (TC) | Tray | A54SX16P | 3A001.A.2.C | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G208 | 175 | Not Qualified | 3.3 V, 5 V | 3.3,3.3/5 V | MILITARY | 175 | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 1452 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-FGG256M | Microchip Technology | Datasheet | 451 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-1FG484M | Microchip Technology | Datasheet | 1973 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | 484-FPBGA (23x23) | M2GL025 | 60 | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL025TS | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-3BGG272I | Microchip Technology | Datasheet | 451 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 100 MHz | 40 | MICROSEMI CORP | A42MX36-3BGG272I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 202 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Obsolete | 40 | 5.26 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A42MX36 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||
| Mfr Part No MPF300TL-FCG784E | Microchip Technology | Datasheet | 2080 |
| Min: 1 Mult: 1 | Surface Mount | BGA-784 | 784-FCBGA (29x29) | MPF300 | 1 | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 388 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 20.6 Mbit | PolarFire | 0°C ~ 100°C (TJ) | Tray | MPF300TL | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-1FG896I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-1FG896I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No A3P600-PQ208I | Microchip Technology | Datasheet | 38 | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | 208 | 208-PQFP (28x28) | A3P600 | 24 | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 154 I/O | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P600 | 85 °C | -40 °C | 1.425V ~ 1.575V | 231 MHz | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 231 MHz | 13824 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-1FGG256 | Microchip Technology | Datasheet | 1674 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FGG256 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No A42MX16-PQG160I | Microchip Technology | Datasheet | 2162 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-160 | YES | 160-PQFP (28x28) | 160 | A42MX16 | 94 MHz | 24 | MICROSEMI CORP | A42MX16-PQG160I | 172 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 125 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Active | Active | 40 | 1.52 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -40°C ~ 85°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | STD | 2.8 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-2BGG272I | Microchip Technology | Datasheet | 508 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 91 MHz | 40 | MICROSEMI CORP | A42MX36-2BGG272I | 164 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 202 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | ROHS COMPLIANT, PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | Obsolete | 40 | 5.26 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A42MX36 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||
| Mfr Part No A42MX36-3BG272I | Microchip Technology | Datasheet | 451 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 100 MHz | 40 | MICROSEMI CORP | A42MX36-3BG272I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 202 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | 30 | 5.2 | N | No | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A42MX36 | e0 | TIN LEAD SILVER | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||
| Mfr Part No A40MX04-2PLG44 | Microchip Technology | Datasheet | 1636 |
| Min: 1 Mult: 1 | Surface Mount | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | A40MX04 | 101 MHz | 27 | MICROSEMI CORP | A40MX04-2PLG44 | 175 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 34 I/O | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-44 | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.084185 oz | 0°C ~ 70°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2 ns | 547 | 6000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-2FG896I | Microchip Technology | Datasheet | 499 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-2FG896I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FG256I | Microchip Technology | Datasheet | 2024 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M7A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M7A3P1000-2FG256I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||
| Mfr Part No M1AFS600-1FGG256K | Microchip Technology | Datasheet | 531 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-1FGG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V2-FG484 | Microchip Technology | Datasheet | 779 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AGLE3000 | 60 | MICROSEMI CORP | M1AGLE3000V2-FG484 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.5 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | M1AGLE3000V2 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.2 V to 1.5 V | COMMERCIAL | 1.575 V | 1.14 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 516096 | 3000000 | 892.86 MHz | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||
| Mfr Part No AX250-1FGG484I | Microchip Technology | Datasheet | 2351 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 248 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FG484 | Microchip Technology | Datasheet | 2203 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-2FGG484I | Microchip Technology | Datasheet | 1606 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS600 | 60 | MICROSEMI CORP | AFS600-2FGG484I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 172 I/O | 7000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||
| Mfr Part No AX1000-2FGG484 | Microchip Technology | Datasheet | 500 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 870 MHz | 60 | MICROSEMI CORP | AX1000-2FGG484 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 317 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 870 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No |
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A54SX16P-1PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,540.022380
-
M2GL025TS-1FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A42MX36-3BGG272I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
815.785446
-
MPF300TL-FCG784E
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
490.251281
-
M1A3PE3000-1FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600-PQ208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A54SX72A-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
302.311056
-
A42MX16-PQG160I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
258.808290
-
A42MX36-2BGG272I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
736.165598
-
A42MX36-3BG272I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
815.785446
-
A40MX04-2PLG44
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
120.460040
-
M1A3PE3000-2FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M7A3P1000-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGLE3000V2-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
236.188448
-
AX500-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
265.202277
-
AFS600-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
238.329547
-
AX1000-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
983.383025