The manufacturer is 'Microchip'
- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
- All Manufacturers:
Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No A3P060-2VQ100I | Microchip Technology | Datasheet | 100 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3P060 | 350 MHz | 90 | MICROSEMI CORP | A3P060-2VQ100I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 1.53 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-1FG484 | Microchip Technology | Datasheet | 2027 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 300 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-1FG896I | Microchip Technology | Datasheet | 563 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FG896I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000 | e0 | TIN LEAD | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-PQG208I | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M1A3P1000-PQG208I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.225753 oz | -40 to 85 °C | Tray | M1A3P1000 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG256A | Microchip Technology | Datasheet | 1696 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | APA450 | 90 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 13.5 kB | 110592 | 450000 | 180 MHz | STD | 12288 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-2PQG208 | Microchip Technology | Datasheet | 1790 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | M7A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M7A3P1000-2PQG208 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 154 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Not Recommended | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M7A3P1000 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7AFS600-FGG256 | Microchip Technology | Datasheet | 2245 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M7AFS600 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-CGS624B | Microchip Technology | Datasheet | 688 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | CCGA-624 | 624 | 624-CCGA (32.5x32.5) | APA600 | 1 | 150 MHz | Microchip Technology | Yes | SMD/SMT | 440 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | Actel | -55°C ~ 125°C (TJ) | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 2.5 V | 5 mA | 15.8 kB | 129024 | 600000 | 150 MHz | 21504 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FGG256A | Microchip Technology | Datasheet | 490 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA600 | 90 | MICROSEMI CORP | APA600-FGG256A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | Details | Yes | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA600 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 186 | FIELD PROGRAMMABLE GATE ARRAY | 129024 | 600000 | STD | 21504 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-PQG208A | Microchip Technology | Datasheet | 1704 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | APA150 | 24 | MICROSEMI CORP | APA150-PQG208A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 158 I/O | Tray | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Active | Active | 5.61 | Details | Yes | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | -40°C ~ 125°C (TJ) | Tray | APA150 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 158 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | STD | 6144 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL250V5-FG144I | Microchip Technology | Datasheet | 75 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 97 | 6144 | AGL250 | 108 MHz | 250000 | 160 | IGLOO | MICROSEMI CORP | AGL250V5-FG144I | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 97 I/O | 3000 LE | 250000 | 1.575(V) | 1.425(V) | 1.5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | FBGA | Active | 130NM | Active | Yes | No | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AGL250V5 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | 144 | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | - | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-FGG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FGG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-FGG484M | Microchip Technology | Datasheet | 564 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FGG484M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-2PQG208 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3P600 | 350 MHz | 24 | MICROSEMI CORP | A3P600-2PQG208 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 154 I/O | 85 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3P600 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 310 MHz | 2 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL250V5-FG144 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | AGL250 | 108 MHz | 160 | MICROSEMI CORP | AGL250V5-FG144 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AGL250V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | 1.5 V | OTHER | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-1FGG484I | Microchip Technology | Datasheet | 2379 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-1FGG484I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 270 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL600V5-FG256I | Microchip Technology | Datasheet | 1687 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V5-FG256I | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AGL600V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | - | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-1FG256 | Microchip Technology | Datasheet | 1931 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | M7A3P1000 | 90 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 177 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FGG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 763 MHz | 27 | MICROSEMI CORP | AX1000-1FGG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX04-PLG68 | Microchip Technology | Datasheet | 105 |
| Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 80 MHz | 19 | MICROSEMI CORP | A40MX04-PLG68 | 139 MHz | 5.25 V | + 70 C | Microchip Technology | 3 V | 0 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 57 I/O | 547 LAB | 547 LE | 70 °C | Tube | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 1.52 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 3.3, 5 V | 0.171777 oz | 0 to 70 °C | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 6000 | STD | - | 2.7 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm |
A3P060-2VQ100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7A3P1000-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE3000-1FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
795.962671
M1A3P1000-PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-FGG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
330.639736
M7A3P1000-2PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7AFS600-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-CGS624B
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-FGG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
557.999882
APA150-PQG208A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL250V5-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
47.577336
M1A3P1000-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P600-2PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL250V5-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
41.451787
A3PE600-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL600V5-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
164.249723
M7A3P1000-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-1FGG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A40MX04-PLG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
91.947691
