The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No APA750-BG456 | Microchip Technology | Datasheet | 652 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA750 | 24 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 356 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0°C ~ 70°C (TA) | Tray | APA750 | 70 °C | 0 °C | 2.3V ~ 2.7V | 2.5 V | 2.7 V | 2.3 V | 18 kB | 147456 | 750000 | 180 MHz | STD | 32768 | 1.73 mm | 35 mm | 35 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG256A | Microchip Technology | Datasheet | 2319 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA450 | 90 | MICROSEMI CORP | APA450-FG256A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 186 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-BG456I | Microchip Technology | Datasheet | 665 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | BGA-456 | YES | 456 | 456-PBGA (35x35) | 456 | APA750 | 180 MHz | 24 | MICROSEMI CORP | APA750-BG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 356 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA750 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180 MHz | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 18 kB | 356 | 750000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 750000 | 1.73 mm | 35 mm | 35 mm | No | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG144 | Microchip Technology | Datasheet | 2083 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA450 | 180 MHz | 160 | MICROSEMI CORP | APA450-FG144 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 100 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 100 | 450000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-CQ208B | Microchip Technology | Datasheet | 797 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | APA300 | 180 MHz | 1 | MICROSEMI CORP | APA300-CQ208B | 5 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 158 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | Bulk | APA300 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 158 | 300000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | MIL-STD-883 Class B | 8192 | 300000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FG676M | Microchip Technology | Datasheet | 699 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 763 MHz | 40 | MICROSEMI CORP | AX1000-1FG676M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 418 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | Contains Lead | ||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-CQ256B | Microchip Technology | Datasheet | 714 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-256 | YES | 256 | 256-CQFP (75x75) | 256 | A42MX36 | 73 MHz | 1 | MICROSEMI CORP | A42MX36-CQ256B | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 202 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 20 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 3.3 V | 3.3 V | 3.3 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 256 | S-CQFP-F256 | Not Qualified | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 54000 | 36 mm | 36 mm | No | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-1CQ256B | Microchip Technology | Datasheet | 740 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-256 | YES | 256 | 256-CQFP (75x75) | 256 | A42MX36 | 83 MHz | 1 | MICROSEMI CORP | A42MX36-1CQ256B | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 202 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 20 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 3.3 V | 3.3 V | 3.3 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 256 | S-CQFP-F256 | Not Qualified | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 2560 | 54000 | MIL-STD-883 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 36 mm | 36 mm | No | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG144I | Microchip Technology | Datasheet | 2015 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA150 | 180 MHz | 160 | MICROSEMI CORP | APA150-FG144I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 100 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA150 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | not_compliant | 180 MHz | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 4.5 kB | 100 | 150000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | 180 MHz | 6144 | 6144 | 150000 | 1.05 mm | 13 mm | 13 mm | No | Contains Lead | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-2FG896 | Microchip Technology | Datasheet | 557 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 896 | 896-FBGA (31x31) | 400.011771 mg | AX2000 | 27 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 586 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX2000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 870 MHz | 1.5 V | 1.575 V | 1.425 V | 36 kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870 MHz | 32256 | 21504 | 2 | 21504 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG484 | Microchip Technology | Datasheet | 724 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | APA600 | 60 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 370 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA600 | 70 °C | 0 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-CQ208M | Microchip Technology | Datasheet | 482 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | 208-CQFP (75x75) | A54SX32 | 1 | 238 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | Actel | -55°C ~ 125°C (TC) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BG456I | Microchip Technology | Datasheet | 471 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | 290 | 8192 | APA300 | 180 MHz | 300000 | 24 | PROASICPLUS | MICROSEMI CORP | APA300-BG456I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 290 I/O | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | BGA | Active | 0.22UM | Active | Yes | No | 30 | 5.24 | N | No | FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180(MHz) | 456 | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FG484M | Microchip Technology | Datasheet | 644 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 763 MHz | 60 | MICROSEMI CORP | AX1000-1FG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-1CQ208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | A42MX36 | 83 MHz | 1 | MICROSEMI CORP | A42MX36-1CQ208 | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 176 I/O | 70 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, QFP-208 | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 5.19 | N | No | 3.3 V | 3.3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | A42MX36 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | 208 | S-CQFP-F208 | Not Qualified | 3.3 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 1184 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 29.21 mm | 29.21 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX500-1FG484I | Microchip Technology | Datasheet | 1961 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG144A | Microchip Technology | Datasheet | 2142 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA150 | 160 | MICROSEMI CORP | APA150-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 4.5 kB | 100 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | 180 MHz | STD | 6144 | 6144 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-CQ208B | Microchip Technology | Datasheet | 719 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | 208-CQFP (75x75) | A54SX32 | 1 | 238 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | Actel | -55°C ~ 125°C (TJ) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-CQ256M | Microchip Technology | Datasheet | 578 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-256 | 256-CQFP (75x75) | A54SX72 | 1 | 217 MHz | + 125 C | Microchip Technology | - 55 C | SMD/SMT | 213 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | Actel | -55°C ~ 125°C (TC) | A54SX72A | 2.25V ~ 5.25V | 2.5 V | 108000 | 6036 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32-CQ208B | Microchip Technology | Datasheet | 787 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | CQFP | YES | 208 | 208-CQFP (75x75) | 10.567001 g | 208 | A54SX32 | 205 MHz | 1 | MICROSEMI CORP | A54SX32-CQ208B | 205 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 3.6 V | 3 V | 3.3 V | Actel | 0.372740 oz | Military grade | -55°C ~ 125°C (TJ) | A54SX32 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 246 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | MILITARY | 5.5 V | 4.5 V | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 205 MHz | 2880 | MIL-STD-883 Class B | 2880 | 1080 | 1 ns | 2880 | 2880 | 32000 | 2.8 mm | 29.21 mm | 29.21 mm | No |
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