The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No A54SX32-1CQ208 | Microchip Technology | Datasheet | 458 |
| Min: 1 Mult: 1 | Surface Mount | CQFP | YES | 208-CQFP (75x75) | 208 | A54SX32 | 240 MHz | 1 | MICROSEMI CORP | A54SX32-1CQ208 | 240 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 174 I/O | 70 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.23 | N | No | 3.6 V | 3 V | 3.3 V | Actel | 0.372740 oz | 0°C ~ 70°C (TA) | A54SX32 | e0 | TIN LEAD | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 246 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | COMMERCIAL | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.9 ns | 2880 | 2880 | 32000 | 2.8 mm | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG256I | Microchip Technology | Datasheet | 704 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | 186 | 12288 | APA450 | 450000 | 90 | PROASICPLUS | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | Surface Mount | SMD/SMT | 186 I/O | 450000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | Industrial | Tray | FBGA | 0.22UM | Active | Yes | No | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA450 | 85 °C | -40 °C | 2.3V ~ 2.7V | 180(MHz) | 256 | 2.5 V | 2.7 V | 2.3 V | 13.5 kB | 110592 | 450000 | 180 MHz | STD | 12288 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG256M | Microchip Technology | Datasheet | 570 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 186 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA300 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-CQ208M | Microchip Technology | Datasheet | 517 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | 208-CQFP (75x75) | A54SX72 | 1 | 217 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 171 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | Actel | -55°C ~ 125°C (TC) | A54SX72A | 2.25V ~ 5.25V | 2.5 V | 108000 | 6036 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-FG484 | Microchip Technology | Datasheet | 656 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FG484 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 317 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG256 | Microchip Technology | Datasheet | 2364 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA150 | 180 MHz | 90 | MICROSEMI CORP | APA150-FG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA150 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 150000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | STD | 6144 | 150000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-2PQG208 | Microchip Technology | Datasheet | 571 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A54SX72 | 294 MHz | 24 | MICROSEMI CORP | A54SX72A-2PQG208 | 294 MHz | 2.75 V | + 70 C | Microchip Technology | 2.25 V | 0 C | Yes | 3 | SMD/SMT | 171 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.26 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 2.5000 V | 0 to 70 °C | Tray | A54SX72A | e3 | MATTE TIN | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 171 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 2 | 1.1 ns | 6036 | 6036 | 108000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BG456M | Microchip Technology | Datasheet | 439 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 356 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.54 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-PQG208I | Microchip Technology | Datasheet | 1932 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | APA450 | 180 MHz | 108 kbit | 108 kbit | 24 | MICROSEMI CORP | APA450-PQG208I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 158 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | 110592 bit | ProASICPLUS | 2.5000 V | -40 to 85 °C | Tray | APA450 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 180 MHz | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 13.5 kB | 5 mA | 13.5 kB | 158 | 450000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 3.4 mm | 28 mm | 28 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG144M | Microchip Technology | Datasheet | 697 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA300 | 180 MHz | 160 | MICROSEMI CORP | APA300-FGG144M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 100 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA300 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-1CQ208B | Microchip Technology | Datasheet | 579 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | A54SX72 | 250 MHz | 1 | MICROSEMI CORP | A54SX72A-1CQ208B | 250 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 171 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX72A | e0 | 3A001.A.2.C | TIN LEAD | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 171 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | 171 | 6036 CLBS, 108000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | MIL-STD-883 Class B | 1.3 ns | 6036 | 6036 | 108000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA075-FG144A | Microchip Technology | Datasheet | 1705 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA075 | 160 | MICROSEMI CORP | APA075-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA075 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 100 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 75000 | STD | 3072 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS250-1FGG256 | Microchip Technology | Datasheet | 1624 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-1FGG256 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-1FGG484 | Microchip Technology | Datasheet | 404 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS1500 | 60 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 223 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.28205 GHz | 1 | 38400 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG256 | Microchip Technology | Datasheet | 1742 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA450 | 180 MHz | 90 | MICROSEMI CORP | APA450-FG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 450000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG256 | Microchip Technology | Datasheet | 2346 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32-CQ208M | Microchip Technology | Datasheet | 600 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | CQFP | YES | 208 | 208-CQFP (75x75) | 10.567001 g | 208 | A54SX32 | 205 MHz | 1 | MICROSEMI CORP | A54SX32-CQ208M | 205 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 3.6 V | 3 V | 3.3 V | Actel | 0.372740 oz | -55°C ~ 125°C (TC) | A54SX32 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | 205 MHz | S-CQFP-F208 | 246 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | MILITARY | 5.5 V | 4.5 V | 1 ns | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | 2880 | 48000 | 205 MHz | 2880 | 2880 | 1080 | 1 ns | 2880 | 2880 | 32000 | 2.8 mm | 29.21 mm | 29.21 mm | No | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA075-PQG208 | Microchip Technology | Datasheet | 69 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | APA075 | 180 MHz | 24 | MICROSEMI CORP | APA075-PQG208 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 158 I/O | 1000 LE | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | 27648 bit | ProASICPLUS | 2.5000 V | 0 to 70 °C | Tray | APA075 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 5 mA | - | 158 | 75000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 75000 | STD | - | 3072 | 75000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG144A | Microchip Technology | Datasheet | 532 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA450 | 160 | MICROSEMI CORP | APA450-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 100 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-FG256 | Microchip Technology | Datasheet | 1911 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 1.2 mm | 17 mm | 17 mm | No |
A54SX32-1CQ208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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APA450-FGG256I
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658.601606
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189.039522
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587.101508
APA1000-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
729.273961
A54SX72A-1CQ208B
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
17,578.236683
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
200.830123
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196.195822
AFS1500-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
674.476528
APA450-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
251.025722
APA300-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
386.841211
A54SX32-CQ208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8,249.677187
APA075-PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
890.540544
AFS600-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
239.360400
