The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No M1AGL600V5-CSG281 | Microchip Technology | Datasheet | 2323 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V5-CSG281 | Microchip Technology | Yes | 3 | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL600V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | 30 | S-PBGA-B281 | Not Qualified | OTHER | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2PQG208 | Microchip Technology | Datasheet | 16 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P400 | 350 MHz | 24 | MICROSEMI CORP | M1A3P400-2PQG208 | Microchip Technology | Yes | 3 | SMD/SMT | 151 | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FG256 | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 90 | MICROSEMI CORP | M1A3P400-1FG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN250-2VQG100 | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN250 | 90 | MICROSEMI CORP | A3PN250-2VQG100 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 68 I/O | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN250 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 3 mA | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-CS196 | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | CSP | YES | 196-CSP (8x8) | 196 | AGL400 | 348 | MICROSEMI CORP | AGL400V2-CS196 | 250 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 143 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0 to 70 °C | Tray | AGL400V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B196 | Not Qualified | 1.2 V to 1.5 V | OTHER | 27 uA | 9216 CLBS, 400000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 0.7 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No U1AFS1500-FG256 | Microchip Technology | Datasheet | 1705 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | U1AFS1500 | 90 | MICROSEMI CORP | U1AFS1500-FG256 | Microchip Technology | Yes | 3 | 119 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0°C ~ 85°C (TJ) | Tray | U1AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 38400 CLBS, 1500000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 1500000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-FGG484K | Microchip Technology | Datasheet | 760 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AFS1500 | 350 MHz | 60 | MICROSEMI CORP | AFS1500-FGG484K | Microchip Technology | Yes | 3 | 223 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.79 | Details | Yes | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 223 | Not Qualified | 1.5,3.3 V | 33.8 kB | 223 | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1.5e+06 | STD | 38400 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V5-FG256I | Microchip Technology | Datasheet | 1603 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V5-FG256I | Microchip Technology | Yes | 3 | SMD/SMT | 177 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V5 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FGG144I | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-1FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN250-1VQ100 | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN250 | 90 | MICROSEMI CORP | A3PN250-1VQ100 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 68 I/O | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN250 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 3 mA | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3PN060-2VQG100 | Microchip Technology | Datasheet | 10 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN060 | 90 | MICROSEMI CORP | A3PN060-2VQG100 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 71 I/O | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN060 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 2 mA | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN060V2-VQ100I | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | VQFP-100 | YES | 100-VQFP (14x14) | 100 | AGLN060 | 90 | MICROSEMI CORP | AGLN060V2-VQ100I | 250 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 700 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.59 | N | No | 1.575 V | 1.14 V | 1.2 V | IGLOO nano | -40°C ~ 100°C (TJ) | Tray | AGLN060V2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | - | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | STD | - | 1536 | 60000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2FGG144I | Microchip Technology | Datasheet | 16 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-2FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FG484M | Microchip Technology | Datasheet | 480 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | FPGA - Field Programmable Gate Array ProASIC3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | - | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | Contains Lead | ||||||||||||
| Mfr Part No M1A3P400-2FG144I | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-2FG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FG484I | Microchip Technology | Datasheet | 1851 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | P1AFS1500 | 60 | Microchip Technology | Yes | 223 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | -40°C ~ 100°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-1FGG324I | Microchip Technology | Datasheet | 2273 | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | M1A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | M1A3PE3000-1FGG324I | Microchip Technology | Yes | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FGG484K | Microchip Technology | Datasheet | 2373 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M1AFS600 | 350 MHz | 60 | MICROSEMI CORP | M1AFS600-1FGG484K | Microchip Technology | Yes | 3 | 172 | Tray | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 172 | Not Qualified | 1.5,3.3 V | 172 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V5-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V5-FG256 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V5 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2FG144 | Microchip Technology | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 400000 | 400000 | 160 | MICROSEMI CORP | M1A3P400-2FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm |
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M1AGL600V5-CSG281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PN250-2VQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL400V2-CS196
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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U1AFS1500-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
267.290658
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AFS1500-FGG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
923.486586
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M1AGL1000V5-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
219.017591
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M1A3P400-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PN250-1VQ100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PN060-2VQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGLN060V2-VQ100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE3000L-1FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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P1AFS1500-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
543.681918
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M1A3PE3000-1FGG324I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS600-1FGG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
424.990944
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M1AGL1000V5-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire