The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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![]() | Mfr Part No M1A3P600L-FGG144I | Microchip Technology | Datasheet | 1780 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 350 MHz | 160 | MICROSEMI CORP | M1A3P600L-FGG144I | 781.25 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||
![]() | Mfr Part No M1AFS1500-2FGG256I | Microchip Technology | Datasheet | 2348 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS1500 | 90 | MICROSEMI CORP | M1AFS1500-2FGG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 1500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||
![]() | Mfr Part No M1AGL1000V5-FG484I | Microchip Technology | Datasheet | 2180 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V5-FG484I | Microchip Technology | Yes | 3 | SMD/SMT | 300 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V5 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600L-1FGG144I | Microchip Technology | Datasheet | 1900 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 350 MHz | 160 | MICROSEMI CORP | M1A3P600L-1FGG144I | 892.86 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 5 mA | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||
![]() | Mfr Part No A3PE3000L-FG484M | Microchip Technology | Datasheet | 526 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000L-FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | |||||||||||||
![]() | Mfr Part No M1A3PE3000L-FG484I | Microchip Technology | Datasheet | 458 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||
![]() | Mfr Part No A3PN125-2VQ100I | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN125 | 90 | MICROSEMI CORP | A3PN125-2VQ100I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.26 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN125 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 2 mA | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 2 | 3072 | 125000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No AGLN125V5-VQ100 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | AGLN125 | 90 | MICROSEMI CORP | AGLN125V5-VQ100 | 250 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 71 I/O | 1500 LE | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.59 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOO nano | -20°C ~ 85°C (TJ) | Tray | AGLN125V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 18 uA | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1AGL1000V5-FGG256 | Microchip Technology | Datasheet | 2053 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V5-FGG256 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||
![]() | Mfr Part No A3PN125-1VQ100I | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN125 | 90 | MICROSEMI CORP | A3PN125-1VQ100I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.26 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN125 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 2 mA | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 1 | 3072 | 125000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FGG896M | Microchip Technology | Datasheet | 2016 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | A3PE3000L-1FGG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 25 mA | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 350 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | No | ||||||||
![]() | Mfr Part No M1AGL1000V5-FG484 | Microchip Technology | Datasheet | 1948 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V5-FG484 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V5 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | OTHER | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No A3P030-2QNG68 | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3P030 | 350 MHz | 260 | MICROSEMI CORP | A3P030-2QNG68 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | COMMERCIAL | 2 mA | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 2 | 768 | 30000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AGL1000V2-CS281 | Microchip Technology | Datasheet | 2168 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CSP-281 | YES | 281 | 281-CSP (10x10) | 281 | M1AGL1000 | 108 MHz | 184 | MICROSEMI CORP | M1AGL1000V2-CS281 | Microchip Technology | Yes | SMD/SMT | 215 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 10 mm | 10 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No A3P600L-1FG144 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | 160 | MICROSEMI CORP | A3P600L-1FG144 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P600L | e0 | TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | ||||||
![]() | Mfr Part No AGLP060V2-CSG201 | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | CSP-201 | YES | 201-CSP (8x8) | 201 | AGLP060 | 160 MHz | 348 | MICROSEMI CORP | AGLP060V2-CSG201 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 70 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | IGLOO PLUS | 1.2, 1.5 V | 0 to 70 °C | Tray | AGLP060V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 201 | S-PBGA-B201 | 157 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 0.66 mm | 8 mm | 8 mm | |||||||||||||||||||||
![]() | Mfr Part No M1A3P400-1PQG208 | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P400 | 350 MHz | 24 | MICROSEMI CORP | M1A3P400-1PQG208 | Microchip Technology | Yes | 3 | SMD/SMT | 151 | 85 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-1FG484M | Microchip Technology | Datasheet | 411 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-1FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-FG484 | Microchip Technology | Datasheet | 425 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484 | 781.25 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE3000L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No AGL250V2-CS196I | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | CSP-196 | YES | 196-CSP (8x8) | 196 | AGL250 | 108 MHz | 348 | MICROSEMI CORP | AGL250V2-CS196I | 250 MHz | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | SMD/SMT | 143 I/O | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | -40 to 85 °C | Tray | AGL250V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B196 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 20 uA | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 0.7 mm | 8 mm | 8 mm |
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