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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Device Logic Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
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![]() | Mfr Part No A2F500M3G-FG484 | Microchip Technology | Datasheet | 1640 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 60 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FG256 | Microchip Technology | Datasheet | 1705 |
| Min: 1 Mult: 1 | FPBGA-256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 117 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025TS-1FGG484 | Microchip Technology | Datasheet | 1777 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S025 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S025TS-1FGG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No A2F200M3F-1CS288 | Microchip Technology | Datasheet | 36 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CS288 | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 2000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | ||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1CSG288 | Microchip Technology | Datasheet | 1639 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | ARM Cortex M3 | 64 kB | 176 | - | - | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010T-1VFG400I | Microchip Technology | Datasheet | 18 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||
![]() | Mfr Part No M2S090-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1FG256 | Microchip Technology | Datasheet | 2252 |
| Min: 1 Mult: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | |||||||||||
![]() | Mfr Part No M2S060-1FCS325I | Microchip Technology | Datasheet | 2216 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060-1FCS325I | 166 MHz | Microchip Technology | Yes | 200 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1PQ208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500M3G | ARM Cortex M3 | 64 kB | 24 | - | - | 100 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 113 I/O | - | 6000 LE | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | SmartFusion | 0.183425 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1FGG484I | Microchip Technology | Datasheet | 1993 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FGG896 | Microchip Technology | Datasheet | 2276 |
| Min: 1 Mult: 1 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||
![]() | Mfr Part No M2S005S-1FGG484T2 | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 60 | MICROSEMI CORP | - | - | M2S005S-1FGG484T2 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | Tray | , | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-1FGG484I | Microchip Technology | Datasheet | 2262 | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-1VFG400 | Microchip Technology | Datasheet | 32 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010-1VFG400 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||
![]() | Mfr Part No M2S050-1VFG400I | Microchip Technology | Datasheet | 2120 | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S050-1VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-CS288 | Microchip Technology | Datasheet | 22 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | ARM Cortex M3 | 64 kB | 176 | - | - | 80 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1VFG400T2 | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | BGA-400 | 400-VFBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 90 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 171 I/O | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0.652216 oz | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010TS-1VF256I | Microchip Technology | Datasheet | 18 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010TS-1VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1CS288 | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F500M3G-1CS288 | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm |
A2F500M3G-FG484
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Package:Embedded - System On Chip (SoC)
141.632891
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116.263463
M2S025TS-1FGG484
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133.321112
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Package:Embedded - System On Chip (SoC)
78.536862
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120.535141
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Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1FG256
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Package:Embedded - System On Chip (SoC)
130.626971
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Package:Embedded - System On Chip (SoC)
189.113514
A2F500M3G-1PQ208I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
169.486910
M2S050T-FGG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
170.097560
M2S005S-1FGG484T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
70.765623
M2S025T-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-1VFG400
Microchip Technology
Package:Embedded - System On Chip (SoC)
82.045415
M2S050-1VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-CS288
Microchip Technology
Package:Embedded - System On Chip (SoC)
107.565310
M2S005S-1VFG400T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010TS-1VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
89.378291
A2F500M3G-1CS288
Microchip Technology
Package:Embedded - System On Chip (SoC)
89.864926
