The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Contact Finish Mating | Contact Sizes | Data RAM Size | Device Logic Gates | Ihs Manufacturer | Input Frequency | Isolation Voltage (Min) | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature Max Deg. C | Operating Temperature Min Deg. C | Operating Temperature-Max | Operating Temperature-Min | Output Power (Max) | Outside Length | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Depth (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage Rated | Voltage, Rating | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Composition | Color | Applications | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Frequency Stability | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Efficiency | Output Voltage | Housing Color | ESR (Equivalent Series Resistance) | Lead Spacing | Power Supplies | Temperature Grade | Note | Voltage | Load Capacitance | Speed | RAM Size | Operating Mode | Output Current | Shell Size, MIL | Lead Style | Core Processor | Number of Poles | Frequency Tolerance | Peripherals | Program Memory Size | Connectivity | Output Power | Switch Type | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Includes | Max Frequency | Screening Level | Speed Grade | Primary Attributes | Number of Bands | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Disconnect Type | Features | Nominal Input Voltage (AC) | Input Voltage | IP Rating | Product Length (mm) | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Product Height (mm) | Material Flammability Rating | Ratings |
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 | Mfr Part No M2S005S-1VF256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VF256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Continental Belt | 11/5V2650 | Microchip Technology | MCU - 25, FPGA - 66 | 265 Inches | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | CUL, UL | M2S090 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DH361UGK | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | Metallic | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 30 A | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 600 V | 166MHz | 64KB | ARM® Cortex®-M3 | 3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Heavy Duty | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100S-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ABB | ACH580-BCR-046A-2+B056 | Panel | ACH580BX122 | 500 Hz | Circuit Breaker | 240 VAC | IP55 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | 47 to 63(Hz) | 3000VAC(V) | Microsemi Corporation | M2S050S-1FGG484I | 3 | Desktop | 60C | -10C | 120 W | Active | 97(mm) | No | 30 | 5.26 | Yes | Commercial grade | e1 | Regulated | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 250 | compliant | 1 | 85(%) | 24(V) | 5(A) | 120(W) | FIELD PROGRAMMABLE GATE ARRAY | Commercial | 85 to 132/170 to 265(V) | 110(mm) | 60(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676IX417 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Non-Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1CS288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | 500000 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1CS288I | 1.575 V | Microchip Technology | 1.425 V | MCU - 31, FPGA - 78 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.24 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | e0 | TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1CSG288I | Microchip Technology | 3 | MCU - 31, FPGA - 78 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090S-1FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 484-BGA | - | Aluminum Alloy | 484-FPBGA (23x23) | KPT06 | Gold | ITT Cannon, LLC | 267 | Bulk | Metal | Active | Non-Compliant | 1000VAC, 1400VDC | -55°C ~ 125°C | KPT | Solder Cup | Plug, Female Sockets | 21 | Olive Drab | Bayonet Lock | 13A | N (Normal) | - | Environment Resistant | Olive Drab Cadmium | 22-21 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Potted | 50.0µin (1.27µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCSG536 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | KYOCERA AVX | 293 | 146124 LE | Bulk | Active | 0°C ~ 85°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Suntsu Electronics, Inc. | SMD/SMT | 377 | 56340 LE | Bulk | Active | -40°C ~ 85°C | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | MHz Crystal | 12 MHz | ±15ppm | 120 Ohms | 10pF | 166MHz | 64KB | Fundamental | ARM® Cortex®-M3 | ±15ppm | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | 0.026 (0.65mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCV484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1808 (4520 Metric) | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Vishay Vitramon | 273 | 146124 LE | Tape & Reel (TR) | Obsolete | 1500V (1.5kV) | -55°C ~ 125°C | VJ OMD | 0.186 L x 0.080 W (4.72mm x 2.03mm) | ±5% | C0G, NP0 | Boardflex Sensitive | 12 pF | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | Soft Termination, High Voltage | - | 0.086 (2.18mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCSG325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060-1FCSG325I | 166 MHz | KYOCERA AVX | 3 | 200 | 56520 LE | Bulk | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.8 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCS325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | Circular | Aluminum | 325-FCBGA (11x11) | - | D38999/26ZA | 22D | 64 kB | - | - | 166 MHz | Amphenol Aerospace Operations | 200 | 56520 LE | Bulk | Active | Non-Compliant | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 6 | Threaded | Crimp | A | Shielded | Environment Resistant | Zinc Nickel | 9-35 | Black | Contacts Not Included | 166MHz | 64KB | A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | 1 Core | 256KB | Coupling Nut, Self Locking | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Mallory Sonalert Products Inc. | 267 | 56520 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-VF400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 400-LFBGA | Flange | Aluminum Alloy | 400-VFBGA (17x17) | CB2 | Silver | 64 kB | - | - | 166 MHz | ITT Cannon, LLC | 207 | 56520 LE | Bulk | Metal | Active | Non-Compliant | 50V | -55°C ~ 125°C | MIL-DTL-5015, CB | Crimp | Receptacle, Male Pins | 22 | Black | Reverse Bayonet Lock | 22A, 41A | N (Normal) | - | IP67 - Dust Tight, Waterproof | Black Zinc Cobalt | 28-11 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | PEI-Genesis | 387 | 56520 LE | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB |
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M2S005S-1VF256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100S-1FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FG676IX417
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1CS288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090S-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCSG536
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FGG896I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCV484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-1FCS325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire