The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Supplier Device Package | Housing Material | Number of Terminals | # I/Os (Max) | Base Product Number | Base/Housing Material | Body Orientation | Brand | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching Regulator | Termination Method | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Number of Terminations | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Gender | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Output Voltage | Housing Color | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Connector Style | Number of Ports | Speed | RAM Size | Output Current | Core Processor | Peripherals | Program Memory Size | Connectivity | Output Power | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Speed Grade | Convert From (Adapter End) | Convert To (Adapter End) | Housing Finish | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Number of Positions (Convert From) | Orientation (Convert From) | Shell Size - Insert (Convert From) | Orientation (Convert To) | Number of Positions (Convert To) | Features | Shell Size - Insert (Convert To) | Input Voltage | Product Category | Height Seated (Max) | Length | Width | Material Flammability Rating |
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 | Mfr Part No M2S090TS-1FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-1FGG676I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56520 LE | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 86316 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FCSG325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Non-Compliant | 13 kV | -40°C ~ 100°C (TJ) | Bulk | SmartFusion®2 | 5 % | 100 °C | -55 °C | 5 nF | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | 45.0088 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCVG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | A2F200 | Microchip Technology | MCU - 41, FPGA - 94 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010TS-VFG400 | 166 MHz | Microchip Technology | 3 | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1VFG256T2 | Microchip Technology | 161 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1PQG208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500 | Microchip Technology | MCU - 22, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCSG325T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 325-TFBGA | - | 325-BGA (11x11) | Thermoplastic | YAA | Amphenol LTW | MCU - 102, FPGA - 80 | Bulk | Active | - | - | M12 | Threaded | - | Unshielded | IP68 - Dust Tight, Waterproof | - | Distributor Y-Shaped | - | 230.4KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | Male Pins | Female Sockets (2) | - | FPGA - 23K Logic Modules | 128KB | 6 | A | M12 | A | 6 (2) | Coupling Nut | M12 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | MICROSEMI CORP | Microsemi Corporation | M2S150TS-1FC1152M | Vishay Dale | 574 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | 3.65 kOhms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | S (0.001%) | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCVG484E | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | Microchip Technology / Atmel | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Gold | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 15 | M2S150 | PCT (Polychlorinated Terphenyl) | Right Angle | Microchip Technology / Atmel | Copper Alloy | 64 kB | 24 | MICROSEMI CORP | - | - | Microchip | M2S150T-1FC1152I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | 1.26 V | 1.14 V | 1.2 V | Solder | 1.2 V | 1.234218 oz | -55 to 125 °C | Tray | SmartFusion®2 | e0 | D-Subminiature | Tin/Lead (Sn/Pb) | Receptacle | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | 15 POS | 1.2 V | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | Through Hole | SMD/SMT | 207 | 27696 LE | Tray | Active | Eighth-Brick | Yes | -40 to 125 °C | SmartFusion®2 | Step Down | 8 | 1 | 3.3 V | 166MHz | 64KB | 20 A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 66 W | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 36 to 75 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | 207 | M2S050 | 64 kB | SMARTFUSION2 | - | - | 56340 | 166 MHz | + 85 C | Microchip Technology | 0 C | Surface Mount | SMD/SMT | 207 | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | 0C to 85C | 85C | 0C | COMMERCIALC | Tray | VFBGA | 65nm | Active | Yes | No | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | 400 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB |
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M2S090TS-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS160T-FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1PQG208
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS025T-1FCSG325T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS250T-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire