The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Data RAM Type | Development Kit | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Power Class | Processor Series | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Channels | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Operating Temperature Range | Protocol | Screening Level | Power - Output | Speed Grade | RF Family/Standard | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Modulation | Number of Cores | Flash Size | ADC Resolution | Height | Length | Width |
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![]() | Mfr Part No M2S005S-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S005 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S005S-1FG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 209 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S060TS-1FGG484I | 166 MHz | Microchip Technology | Yes | 3 | 267 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | IC FPGA SOC 60K LUTS | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | 0.418384 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-1VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060T-1VF400 | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090T-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150TS-1FCV484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | ARM Cortex M3 | 64 kB | 84 | - | - | 166 MHz | Microchip Technology | Yes | 273 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090T-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 273 I/O | 7193 LAB | 86316 LE | Tray | Active | Details | 1.2000 V | 0.766018 oz | -40 to 100 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060-1FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060-1FG676 | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095T-1FCVG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095TL-FCSG536E | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TS-1FCVG784I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TLS-FCVG784I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095TS-FCSG325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Bulk | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS2083BM-232 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA-82 | IS2083 | 8051 | 96 kB | SRAM | 3000 | I2C, UART, USB | 2 Mbps | + 85 C | Microchip Technology | - 40 C | Surface Mount | SMD/SMT | 19 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Class I/Class II | Active | VFBGA | 4.2 V | 3.2 V | Industrial grade | -40 to 85 °C | Reel | - | Bluetooth | 3.2V ~ 4.2V | 2.4GHz | 82 | 3.3 V | 2 | 16MB Flash, 512kB RAM, 832kB ROM | Flash | 2 MB | 9.5 dBm | 3Mbps | 8 bit | IS2083BM | Bluetooth v5.0 | Industrial | - | Bluetooth | Antenna Not Included | - 90 dBm | 2 Channel | GPIO, I²C, I²S, PWM, UART, USB | - | - | 8DPSK, DQPSK, GFSK | 10 bit, 16 bit | 0.9 mm | 5.5 mm | 5.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1025SG41100T-I/E5X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 90 | CAN, Ethernet, USB | 120 MHz | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1025SG41100T-E/E5X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 90 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1025SG41100-E/E5X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tray | PIC32CX | Active | Details | 3.63 V | 1.71 V | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1025SG41128T-E/Z2X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-128 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 99 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1025SG41128T-I/Z2X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-128 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 99 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel |
M2S005S-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060T-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S090T-FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S150TS-1FCV484
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S050T-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S090T-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S090-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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M2S060-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
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MPFS095T-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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MPFS095TL-FCSG536E
Microchip Technology
Package:Embedded - System On Chip (SoC)
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MPFS250TS-1FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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MPFS250TLS-FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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MPFS095TS-FCSG325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
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IS2083BM-232
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
PIC32CX1025SG41100T-I/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
PIC32CX1025SG41100T-E/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
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PIC32CX1025SG41100-E/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
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PIC32CX1025SG41128T-E/Z2X
Microchip Technology
Package:Embedded - System On Chip (SoC)
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PIC32CX1025SG41128T-I/Z2X
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
