Micro Crystal - Memory - Richard Electronics

The manufacturer is 'Micro Crystal'

Ihs Manufacturer
Part Life Cycle Code
Reach Compliance Code
JESD-30 Code
Memory Density
Memory IC Type
Memory Width
Number of Words
Number of Words Code
Organization
Package Body Material
Package Shape

All Manufacturers:
Micro Crystal

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Standby Voltage-Min	Alternate Memory Width	Refresh Cycles	I2C Control Byte	Access Mode	Self Refresh	Length	Width
Mfr Part No X24325PI	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	NO	8		0.1 MHz	IC MICROSYSTEMS SDN BHD	3	4096 words	4000	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0		EAR99	TIN LEAD		8542.32.00.51	DUAL	THROUGH-HOLE	240	1	2.54 mm	unknown		8	R-PDIP-T8	Not Qualified	5.5 V	INDUSTRIAL	4.5 V		SYNCHRONOUS	0.003 mA	4KX8		4.32 mm	8	0.00005 A	32768 bit		SERIAL		EEPROM	I2C	100000 Write/Erase Cycles	10 ms	100	HARDWARE/SOFTWARE				DDDMMMMR			10.03 mm	7.62 mm
Mfr Part No NN514405BJ-60	United Microelectronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	20	60 ns		NIPPON STEEL SEMICONDUCTOR CORP		1048576 words	1000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ20/26,.34	SOJ20/26,.34	RECTANGULAR	SMALL OUTLINE	Obsolete		No	5 V	e0		EAR99	TIN LEAD	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown			R-PDSO-J20	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.08 mA	1MX4	3-STATE		4	0.001 A	4194304 bit			COMMON	EDO DRAM								1024		FAST PAGE WITH EDO	NO
Mfr Part No XL93LC56Y	Exel Microelectronics Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	8		0.25 MHz	EXEL MICROELECTRONICS INC		128 words	128	85 °C	-40 °C	PLASTIC/EPOXY	SOP			RECTANGULAR	SMALL OUTLINE	Obsolete			5 V					AUTOMATIC WRITE		DUAL	GULL WING		1		unknown			R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	2.7 V		SYNCHRONOUS		128X16	3-STATE		16		2048 bit		SERIAL		EEPROM	MICROWIRE		25 ms
Mfr Part No NN511000LJ-60	United Microelectronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	20	60 ns		NIPPON STEEL SEMICONDUCTOR CORP		1048576 words	1000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ20/26,.34	SOJ20/26,.34	RECTANGULAR	SMALL OUTLINE	Obsolete		No	5 V	e0		EAR99	TIN LEAD	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown			R-PDSO-J20	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.055 mA	1MX1	3-STATE		1	0.00005 A	1048576 bit			SEPARATE	FAST PAGE DRAM								512		FAST PAGE
Mfr Part No X24164P-2.7	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	NO	8		0.1 MHz	IC MICROSYSTEMS SDN BHD	3	2048 words	2000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V			EAR99			8542.32.00.51	DUAL	THROUGH-HOLE	240	1	2.54 mm	unknown		8	R-PDIP-T8	Not Qualified	5.5 V	COMMERCIAL	2.7 V		SYNCHRONOUS	0.003 mA	2KX8		4.32 mm	8	0.00005 A	16384 bit		SERIAL		EEPROM	I2C	100000 Write/Erase Cycles	10 ms	100					1DDDMMMR			10.03 mm	7.62 mm
Mfr Part No X25642SI-2.7	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	YES	14		2 MHz	IC MICROSYSTEMS SDN BHD	3	8192 words	8000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOP, SOP14,.25	SOP14,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	No	3 V	e0		EAR99	TIN LEAD		8542.32.00.51	DUAL	GULL WING	240	1	1.27 mm	unknown		14	R-PDSO-G14	Not Qualified	5.5 V	INDUSTRIAL	2.7 V		SYNCHRONOUS	0.005 mA	8KX8		1.75 mm	8	0.000001 A	65536 bit		SERIAL		EEPROM	SPI	100000 Write/Erase Cycles	10 ms	100	HARDWARE/SOFTWARE							8.65 mm	3.9 mm
Mfr Part No X25256S8	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1					IC MICROSYSTEMS SDN BHD	3							,				Obsolete		No				EAR99			8542.32.00.51			240			unknown
Mfr Part No EDI88128LPS55CB	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	32	55 ns		MICROSEMI CORP		131072 words	128000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32	DIP32,.6	RECTANGULAR	IN-LINE	Transferred	DIP	No	5 V		No	3A001.A.2.C			8542.32.00.41	DUAL	THROUGH-HOLE	NOT SPECIFIED	1	2.54 mm	unknown	NOT SPECIFIED	32	R-CDIP-T32	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.2 mA	128KX8	3-STATE		8	0.002 A	1048576 bit	MIL-STD-883	PARALLEL	COMMON	STANDARD SRAM						2 V							10.16 mm
Mfr Part No XLS93LC66P-3	Exel Microelectronics Inc	Datasheet	-	-	Min: 1 Mult: 1	NO	8			EXEL MICROELECTRONICS INC		256 words	256	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.51	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T8	Not Qualified		COMMERCIAL				0.002 mA	256X16			16	0.000002 A	4096 bit		SERIAL		EEPROM	MICROWIRE	100000 Write/Erase Cycles		10	SOFTWARE
Mfr Part No NN514265AJ-50	United Microelectronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	40	50 ns		NIPPON STEEL SEMICONDUCTOR CORP		262144 words	256000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ40,.44	SOJ40,.44	RECTANGULAR	SMALL OUTLINE	Obsolete		No	5 V	e0		EAR99	TIN LEAD	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown			R-PDSO-J40	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.12 mA	256KX16	3-STATE		16	0.001 A	4194304 bit			COMMON	EDO DRAM								512		FAST PAGE WITH EDO	NO
Mfr Part No X24026Y	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	NO	8		0.1 MHz	IC MICROSYSTEMS SDN BHD		256 words	256	70 °C		UNSPECIFIED		,		RECTANGULAR	MICROELECTRONIC ASSEMBLY	Obsolete	CARD	No	5 V	e0		EAR99	TIN LEAD		8542.32.00.51	UNSPECIFIED	UNSPECIFIED		1		unknown		8	R-XXMA-X8	Not Qualified	5.5 V	COMMERCIAL	4.5 V		SYNCHRONOUS		256X8			8		2048 bit		SERIAL		EEPROM	I2C		10 ms
Mfr Part No UM6264AM-10L	United Microelectronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	28	100 ns		UNITED MICROELECTRONICS CORP		8192 words	8000	70 °C		PLASTIC/EPOXY	SOP	SOP, SOP28,.5	SOP28,.5	RECTANGULAR	SMALL OUTLINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	GULL WING			1.27 mm	unknown			R-PDSO-G28	Not Qualified		COMMERCIAL			ASYNCHRONOUS	0.045 mA	8KX8	3-STATE		8	0.0001 A	65536 bit		PARALLEL	COMMON	STANDARD SRAM						2 V
Mfr Part No WS128K32V-20G2UI	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	68	20 ns		MICROSEMI CORP		131072 words	128000	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	QFP	22.40 X 22.40 MM, CERAMIC, QFP-68		SQUARE	FLATPACK	Transferred	QFP	No	3.3 V	e4	No	3A991.B.2.A	GOLD	ALSO CONFIGURABLE AS 512K X 8	8542.32.00.41	QUAD	GULL WING		1	1.27 mm	unknown		68	S-CQFP-G68	Not Qualified	3.6 V	INDUSTRIAL	3 V		ASYNCHRONOUS		128KX32		3.51 mm	32		4194304 bit		PARALLEL		SRAM MODULE							16					22.36 mm	22.36 mm
Mfr Part No X25080V	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	YES	14		2 MHz	IC MICROSYSTEMS SDN BHD	3	1024 words	1000	70 °C		PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP14,.25	TSSOP14,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSSOP	No	5 V	e0		EAR99	TIN LEAD		8542.32.00.51	DUAL	GULL WING	240	1	0.65 mm	unknown		14	R-PDSO-G14	Not Qualified	5.5 V	COMMERCIAL	4.5 V		SYNCHRONOUS	0.005 mA	1KX8		1.2 mm	8	0.000001 A	8192 bit		SERIAL		EEPROM	SPI	100000 Write/Erase Cycles	10 ms	100	HARDWARE/SOFTWARE							5 mm	4.4 mm
Mfr Part No NN514405J-60	United Microelectronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	20	60 ns		NIPPON STEEL SEMICONDUCTOR CORP		1048576 words	1000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ20/26,.34	SOJ20/26,.34	RECTANGULAR	SMALL OUTLINE	Obsolete		No	5 V	e0		EAR99	TIN LEAD	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown			R-PDSO-J20	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.11 mA	1MX4	3-STATE		4	0.001 A	4194304 bit			COMMON	EDO DRAM								1024		FAST PAGE WITH EDO	NO
Mfr Part No WS512K32-25G2UM	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	68	25 ns		MICROSEMI CORP		524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	QFP	22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68		SQUARE	FLATPACK	Transferred	QFP	No	5 V	e4	No	3A001.A.2.C	GOLD	USER CONFIGURABLE AS 2M X 8	8542.32.00.41	QUAD	GULL WING		1	1.27 mm	unknown		68	S-CQFP-G68	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS		512KX32		3.51 mm	32		16777216 bit	MIL-STD-883	PARALLEL		SRAM MODULE							16					22.36 mm	22.36 mm
Mfr Part No X24C02MI-3.5	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	YES	8		0.1 MHz	IC MICROSYSTEMS SDN BHD	3	256 words	256	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP8,.19	TSSOP8,.19	SQUARE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	MSOP	No	5 V	e0		EAR99	TIN LEAD		8542.32.00.51	DUAL	GULL WING	240	1	0.65 mm	unknown		8	S-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	3.5 V		SYNCHRONOUS	0.002 mA	256X8		1.07 mm	8	0.00005 A	2048 bit		SERIAL		EEPROM	I2C	100000 Write/Erase Cycles	10 ms	100	HARDWARE				1010DDDR			3 mm	3 mm
Mfr Part No EDI88128LPS35FB	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	32	35 ns		MICROSEMI CORP		131072 words	128000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DFP	CERAMIC, DFP-32	FL32,.4	RECTANGULAR	FLATPACK	Transferred	DFP	No	5 V		No	3A001.A.2.C			8542.32.00.41	DUAL	FLAT	NOT SPECIFIED	1	1.27 mm	unknown	NOT SPECIFIED	32	R-CDFP-F32	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.2 mA	128KX8	3-STATE	2.9464 mm	8	0.002 A	1048576 bit	MIL-STD-883	PARALLEL	COMMON	STANDARD SRAM						2 V						20.828 mm	10.414 mm
Mfr Part No X24C08P-3.5	IC Microsystems Sdn Bhd	Datasheet	-	-	Min: 1 Mult: 1	NO	8		0.1 MHz	IC MICROSYSTEMS SDN BHD	3	1024 words	1000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0		EAR99	TIN LEAD		8542.32.00.51	DUAL	THROUGH-HOLE	240	1	2.54 mm	unknown		8	R-PDIP-T8	Not Qualified	5.5 V	COMMERCIAL	3.5 V		SYNCHRONOUS	0.003 mA	1KX8		4.07 mm	8	0.00015 A	8192 bit		SERIAL		EEPROM	I2C	100000 Write/Erase Cycles	10 ms	100					1010DMMR			10.03 mm	7.62 mm
Mfr Part No WMS128K8-55CC	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	32	55 ns		MICROSEMI CORP		131072 words	128000	70 °C		CERAMIC, METAL-SEALED COFIRED	DIP	DIP,		RECTANGULAR	IN-LINE	Transferred	DIP	No	5 V	e4	No	EAR99	GOLD		8542.32.00.41	DUAL	THROUGH-HOLE		1		compliant		32	R-CDIP-T32	Not Qualified	5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS		128KX8		5.13 mm	8		1048576 bit		PARALLEL		STANDARD SRAM												42.2 mm