The manufacturer is 'Microsemi'

    • Access Mode
    • Access Time-Max
    • Additional Feature
    • Ihs Manufacturer
    • JESD-30 Code
    • Manufacturer Part Number
    • Memory Density
    • Memory IC Type
    • Memory Width
    • Number of Functions
    • Number of Ports
    • Number of Terminals
    • All Manufacturers:

      Microsemi

    Image

    Part Number

    Manufacturer

    Datasheet

    Availability

    Pricing(USD)

    Quantity

    RoHS

    Surface Mount

    Number of Terminals

    Access Time-Max

    Ihs Manufacturer

    Manufacturer Part Number

    Number of Words

    Number of Words Code

    Operating Temperature-Max

    Operating Temperature-Min

    Package Body Material

    Package Code

    Package Description

    Package Shape

    Package Style

    Part Life Cycle Code

    Part Package Code

    Reflow Temperature-Max (s)

    Risk Rank

    Rohs Code

    Supply Voltage-Nom (Vsup)

    JESD-609 Code

    ECCN Code

    Terminal Finish

    Additional Feature

    HTS Code

    Terminal Position

    Terminal Form

    Peak Reflow Temperature (Cel)

    Number of Functions

    Terminal Pitch

    Reach Compliance Code

    Pin Count

    JESD-30 Code

    Qualification Status

    Supply Voltage-Max (Vsup)

    Temperature Grade

    Supply Voltage-Min (Vsup)

    Number of Ports

    Operating Mode

    Organization

    Seated Height-Max

    Memory Width

    Memory Density

    Memory IC Type

    Access Mode

    Self Refresh

    Length

    Width

    W3E32M72SR-266SBI

    Mfr Part No

    W3E32M72SR-266SBI

    Microsemi Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    208

    0.75 ns

    MICROSEMI CORP

    W3E32M72SR-266SBI

    33554432 words

    32000000

    85 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA,

    RECTANGULAR

    GRID ARRAY

    Transferred

    BGA

    NOT SPECIFIED

    5.21

    No

    2.5 V

    e0

    EAR99

    Tin/Lead (Sn/Pb)

    AUTO/SELF REFRESH

    8542.32.00.36

    BOTTOM

    BALL

    NOT SPECIFIED

    1

    compliant

    208

    R-PBGA-B208

    Not Qualified

    2.7 V

    INDUSTRIAL

    2.3 V

    1

    SYNCHRONOUS

    32MX72

    72

    2415919104 bit

    DDR DRAM

    MULTI BANK PAGE BURST

    YES

    W3E64M72S-266SBM

    Mfr Part No

    W3E64M72S-266SBM

    Microsemi Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    219

    0.75 ns

    MERCURY SYSTEMS INC

    W3E64M72S-266SBM

    67108864 words

    64000000

    125 °C

    -55 °C

    PLASTIC/EPOXY

    BGA

    BGA,

    RECTANGULAR

    GRID ARRAY

    Contact Manufacturer

    30

    5.26

    2.5 V

    EAR99

    AUTO/SELF REFRESH

    8542.32.00.36

    BOTTOM

    BALL

    225

    1

    1.27 mm

    unknown

    R-PBGA-B219

    Not Qualified

    2.7 V

    MILITARY

    2.3 V

    1

    SYNCHRONOUS

    64MX72

    72

    4831838208 bit

    DDR DRAM

    FOUR BANK PAGE BURST

    YES

    W3E32M72SR-266SBM

    Mfr Part No

    W3E32M72SR-266SBM

    Microsemi Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    208

    0.75 ns

    MICROSEMI CORP

    W3E32M72SR-266SBM

    33554432 words

    32000000

    125 °C

    -55 °C

    PLASTIC/EPOXY

    BGA

    BGA,

    RECTANGULAR

    GRID ARRAY

    Transferred

    BGA

    NOT SPECIFIED

    5.23

    No

    2.5 V

    e0

    EAR99

    Tin/Lead (Sn/Pb)

    AUTO/SELF REFRESH

    8542.32.00.36

    BOTTOM

    BALL

    NOT SPECIFIED

    1

    compliant

    208

    R-PBGA-B208

    Not Qualified

    2.7 V

    MILITARY

    2.3 V

    1

    SYNCHRONOUS

    32MX72

    72

    2415919104 bit

    DDR DRAM

    MULTI BANK PAGE BURST

    YES

    W3E32M72SR-266BM

    Mfr Part No

    W3E32M72SR-266BM

    Microsemi Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    208

    0.75 ns

    MICROSEMI CORP

    W3E32M72SR-266BM

    33554432 words

    32000000

    125 °C

    -55 °C

    PLASTIC/EPOXY

    BGA

    BGA,

    RECTANGULAR

    GRID ARRAY

    Transferred

    5.58

    2.5 V

    AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED

    BOTTOM

    BALL

    1

    1 mm

    unknown

    R-PBGA-B208

    2.7 V

    MILITARY

    2.3 V

    1

    SYNCHRONOUS

    32MX72

    2.77 mm

    72

    2415919104 bit

    DDR DRAM

    FOUR BANK PAGE BURST

    YES

    25.1 mm

    16.1 mm