The manufacturer is 'NXP'
- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
- All Manufacturers:
NXP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | On Chip Data RAM Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No SP5746BFK1AVKU2R | NXP USA Inc. | Datasheet | 9 | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 36x10b, 16x12b | 129 | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 120MHz | 384K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No SP5746CHK1AMKU6R | NXP USA Inc. | Datasheet | 20 | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | Mfr Part No S912XEG256BVALR | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 112-LQFP | A/D 16x12b | 91 | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | Active | 3 (168 Hours) | External | 50MHz | 16K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S912XET256W0VAL | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 16384 | 262144 | Automotive grade | -40°C~105°C TA | Tray | HCS12X | Active | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | GULL WING | 1.8V | 0.65mm | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||
 | Mfr Part No S912XEG384BCAGR | NXP USA Inc. | Datasheet | 5200 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | Active | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | GULL WING | 1.8V | 0.5mm | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No S912XEQ384BCAGR | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | Active | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | GULL WING | 1.8V | 0.5mm | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No S912XEQ384BMAGR | NXP USA Inc. | Datasheet | 17 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | A/D 24x12b | 119 | -40°C~125°C TA | Tape & Reel (TR) | 2013 | HCS12X | Active | 3 (168 Hours) | External | 50MHz | 24K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC1112JHI33/203E | NXP USA Inc. | Datasheet | 40 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 32-VFQFN Exposed Pad | A/D 8x10b | 28 | -40°C~105°C TA | Tray | 2010 | LPC1100XL | Active | 3 (168 Hours) | LPC1112 | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCF51JM64EVLH | NXP USA Inc. | Datasheet | 17 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x12b | 51 | 65536 | -40°C~105°C | Tray | 2007 | MCF51JM | e3 | Active | 3 (168 Hours) | 64 | 5A992 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MCF51JM64 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No LPC43S30FET100E | NXP USA Inc. | Datasheet | 15 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 100-TFBGA | A/D 4x10b; D/A 1x10b | 49 | -40°C~85°C TA | Tray | 2010 | LPC43xx | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 100 | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S9S12GN16BVLCR | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-LQFP | A/D 8x10b | 26 | -40°C~105°C TA | Tape & Reel (TR) | HCS12 | Active | 3 (168 Hours) | Internal | 25MHz | 1K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9S12E32CFUE | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 80-QFP | YES | A/D 16x10b; D/A 2x8b | 60 | -40°C~85°C TA | Tray | 1996 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | EAR99 | MATTE TIN | ALSO REQUIRES 3.3V OR 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12E32 | S-PQFP-G80 | Not Qualified | 2.75V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~2.75V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
| Mfr Part No SPC5604BF2VLH6R | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x10b | 45 | 524288 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | Active | 3 (168 Hours) | 64 | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 0.5mm | SPC5604 | S-PQFP-G64 | Not Qualified | 3.6V | 3.3/5V | 3V | Internal | 64MHz | 32K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||
| Mfr Part No FS32K144HAT0CLHT | NXP USA Inc. | Datasheet | 31 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | -40°C~85°C TA | Tray | 2011 | S32K | Active | 3 (168 Hours) | 64 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | compliant | 40 | 5.5V | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 10mm | 10mm | RoHS Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No SPC5645CF0MMJ1 | NXP USA Inc. | Datasheet | 26 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 33x10b, 10x12b | 199 | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | Active | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 5V | 1mm | 40 | SPC5645 | 5.5V | 4.5V | Internal | 80MHz/120MHz | 256K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z4d, e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No S9S08DN48F2MLH | NXP USA Inc. | Datasheet | 342 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 53 | -40°C~125°C TA | Tray | 1996 | S08 | Active | 3 (168 Hours) | 64 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 1.5K x 8 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No MC68HC11E1CFN2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 2003 | HC11 | Obsolete | 3 (168 Hours) | 52 | QUAD | J BEND | 5V | 1.27mm | unknown | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 27mA | 8 | YES | NO | NO | NO | 16 | 512 x 8 | NO | YES | 8 | FIXED-POINT | NO | 8 | 4.57mm | 19.1262mm | 19.1262mm | Non-RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No MC68HC11D0CFNE2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | 26 | -40°C~85°C TA | Tube | HC11 | Obsolete | 3 (168 Hours) | MC68HC11 | Internal | 2MHz | 192 x 8 | 4.5V~5.5V | HC11 | POR, WDT | ROMless | 8-Bit | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC5748GBK0AMMN6 | NXP USA Inc. | Datasheet | 12 | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 324-LBGA | YES | A/D 80x10b, 64x12b | 246 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Tray | MPC57xx | Active | 3 (168 Hours) | 324 | 5A992 | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORTS CAN FD | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | S-PBGA-B324 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.7mm | 19mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No MC705P6ECDWE | NXP USA Inc. | Datasheet | 995 | - | Min: 1 Mult: 1 | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | A/D 4x8b | 21 | -40°C~85°C TA | Tube | 2005 | HC05 | Obsolete | 3 (168 Hours) | MC705P6 | Internal | 2.1MHz | 176 x 8 | 3V~5.5V | POR, WDT | OTP | 8-Bit | 4.5KB 4.5K x 8 | SIO | ROHS3 Compliant |
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SP5746BFK1AVKU2R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SP5746CHK1AMKU6R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S912XEG256BVALR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
S912XET256W0VAL
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S912XEG384BCAGR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
S912XEQ384BCAGR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
S912XEQ384BMAGR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC1112JHI33/203E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MCF51JM64EVLH
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
LPC43S30FET100E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
S9S12GN16BVLCR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9S12E32CFUE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5604BF2VLH6R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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FS32K144HAT0CLHT
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5645CF0MMJ1
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S9S08DN48F2MLH
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11E1CFN2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11D0CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5748GBK0AMMN6
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MC705P6ECDWE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire