The manufacturer is 'NXP'
- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
- All Manufacturers:
NXP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | ADC Resolution (bit) | CECC Qualified | Clock Frequency-Max | DAC Resolution (bit) | Data Bus Width (bit) | Data Converters | ECCN (US) | Family Name | I2C | I2S | Ihs Manufacturer | Instruction Set Architecture | Interface Type | Lead Shape | Manufacturer | Manufacturer Package Code | Manufacturer Part Number | Maximum Clock Rate (MHz) | Maximum CPU Frequency (MHz) | Maximum Expanded Memory Size | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Power Dissipation (mW) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | No. of Timers | Number of ADCs | Number of DAC's | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | Programmability | RAM(byte) | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | ROM(word) | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage (V) | UART | Usage Level | USART | Watchdog | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Seated Height-Max | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Ethernet | USB | ROM Programmability | Source Url Status Check Date | SPI | CAN | PWM | ADC Channels | Device Core | Height Seated (Max) | Length | Width | RoHS Status |
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![]() | Mfr Part No FS32K144MNT0VLLT | NXP USA Inc. | Datasheet | 166 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | -40°C~105°C TA | Tray | 2011 | S32K | Active | 3 (168 Hours) | 100 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | compliant | 40 | 5.5V | 2.7V | Internal | 64MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC908MR32VFUE | NXP USA Inc. | Datasheet | 3040 | - | Min: 1 Mult: 1 | Surface Mount | 64-QFP | YES | A/D 10x10b | 44 | -40°C~105°C TA | Tray | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908MR32 | S-PQFP-G64 | 5.5V | 4.5V | Internal | 8MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 8 | YES | YES | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S08SE8VWLR | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 10x10b | 24 | 512 | 8192 | -40°C~105°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | Active | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | R-PDSO-G28 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | 17.925mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCP11A1CFNE3 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 1996 | HC11 | Obsolete | 3 (168 Hours) | MCP11A1 | External | 3MHz | 256 x 8 | 4.5V~5.5V | HC11 | POR, WDT | ROMless | 8-Bit | SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S9S12G128F0CLHR | NXP USA Inc. | Datasheet | 24 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x10b | 54 | 8192 | 131072 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | Active | 3 (168 Hours) | 64 | QUAD | GULL WING | 5V | 0.5mm | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 22mA | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LPC1347FHN33,551 | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VQFN Exposed Pad | YES | A/D 8x12b | 26 | 65536 | -40°C~85°C TA | Tray | 2010 | LPC13xx | Active | 3 (168 Hours) | 33 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | LPC1347 | 32 | S-PQCC-N33 | Not Qualified | 3.6V | 3.3V | 2V | Internal | 72MHz | 12K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | NO | NO | NO | 4K x 8 | CORTEX-M3 | 2013-06-14 00:00:00 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S9S12P128J0CLHR | NXP USA Inc. | Datasheet | 24 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 10x12b | 49 | 131072 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2004 | HCS12 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | S9S12P128 | S-PQFP-G64 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC908AS32ACFNE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | A/D 15x8b | 40 | -40°C~85°C TA | Tube | 2006 | HC08 | Obsolete | 3 (168 Hours) | MC908AS32 | Internal | 8.4MHz | 1K x 8 | 4.5V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No LPC1788FET208 | NXP Semiconductors | Datasheet | 8068 | - | Min: 1 Mult: 1 | YES | 208 | 12 | No | 25 MHz | 10 | 32 | EAR99 | LPC1700 | 3 | 1 | NXP SEMICONDUCTORS | RISC | CAN/Ethernet/I2C/I2S/UART/USB | Ball | NXP Semiconductors | SOT-950-1 | LPC1788FET208 | 120 | 120 | 1GB | 3.6 | 85 | 1500 | 2.4 | -40 | 2 | Surface Mount | 4 | Single | Single | 165 | 165 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 15 X 15 MM, 0.70 MM HEIGHT, PLASTIC, SOT950-1, TFBGA-208 | BGA208,17X17,32 | 0.8(Max) | 15.1(Max) | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 15.1(Max) | Active | BGA | 208 | Yes | 98304 | 30 | 5.72 | Yes | 524288 | BGA | TFBGA | 3.6 V | 2.4 V | 3.3 V | 3.3 | 5 | 0 | 1 | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | Microcontrollers | CMOS | BOTTOM | BALL | 260 | 0.8 mm | compliant | 208 | S-PBGA-B208 | Not Qualified | 3.3 V | INDUSTRIAL | 120 MHz | 96KB | MICROCONTROLLER, RISC | Flash | 512KB | 100 mA | 32 | YES | YES | YES | 1 | 1.2 mm | 26 | ARM | 32 | 1 | 1 | FLASH | 0 | 2 | 2 | 8 | ARM Cortex M3 | 15 mm | 15 mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SPC5566MVR132R | NXP USA Inc. | Datasheet | 1880 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 416-BBGA | YES | A/D 40x12b | 256 | 3145728 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2003 | MPC55xx Qorivva | Active | 3 (168 Hours) | 416 | 8542.31.00.01 | BOTTOM | BALL | 1.5V | 1mm | PC5566 | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 128K x 8 | 1.35V~1.65V | MICROCONTROLLER, RISC | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 785mA | 32 | YES | YES | YES | 24 | AEC-Q100 | 32 | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LPC4330FET180Y | NXP USA Inc. | Datasheet | 6400 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 8x10b; D/A 1x10b | 118 | -40°C~85°C TA | Tape & Reel (TR) | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 180 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.8mm | NOT SPECIFIED | 180 | S-PBGA-B180 | 3.6V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S12XEQ512CALR | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | Active | 3 (168 Hours) | 112 | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.65mm | NOT SPECIFIED | S-PQFP-G112 | Not Qualified | 1.98V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 4K x 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC56F82748MLH | NXP USA Inc. | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | 64-LQFP | A/D 16x12b; D/A 2x12b | 54 | -40°C~125°C TA | Tray | 2012 | 56F8xxx | Obsolete | 3 (168 Hours) | 260 | 40 | Internal | 100MHz | 8K x 8 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SP5747CHK0AVKU6R | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S08SH4MSC | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 5 | 4096 | -40°C~125°C TA | Tube | 2012 | S08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08SH4 | R-PDSO-G8 | Not Qualified | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SPC5748GBK0AVKU6 | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Tray | MPC57xx | Active | 3 (168 Hours) | 176 | 5A992 | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORTS CAN FD | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 40 | S-PQFP-G176 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.6mm | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MK30DN512ZVLQ10R | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 102 | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis K30 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK30DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SP5748CSK0ACKU2R | NXP USA Inc. | Datasheet | 40 | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | -40°C~85°C TA | Tape & Reel (TR) | MPC57xx | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 40 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC908GR60ACFUE | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | 64-QFP | YES | A/D 24x10b | 53 | -40°C~85°C TA | Tray | 2007 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES AT 3.3V SUPPLY AT 4 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908GR60 | S-PQFP-G64 | Not Qualified | 5.5V | 4.5V | Internal | 8MHz | 2K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 60KB 60K x 8 | SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LPC4367JET256E | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 16x10b; D/A 1x10b | 164 | -40°C~105°C TA | Bulk | 2010 | LPC43xx | Active | 3 (168 Hours) | Internal | 204MHz | 154K x 8 | 2.4V~3.6V | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | 16K x 8 | ROHS3 Compliant |
FS32K144MNT0VLLT
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC908MR32VFUE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08SE8VWLR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCP11A1CFNE3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
S9S12G128F0CLHR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC1347FHN33,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
S9S12P128J0CLHR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC908AS32ACFNE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC1788FET208
NXP Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
SPC5566MVR132R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC4330FET180Y
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S12XEQ512CALR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC56F82748MLH
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
SP5747CHK0AVKU6R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08SH4MSC
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
SPC5748GBK0AVKU6
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MK30DN512ZVLQ10R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
SP5748CSK0ACKU2R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC908GR60ACFUE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC4367JET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
