The manufacturer is 'NXP'
- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
- All Manufacturers:
NXP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No LPC1114FHN33/302:5 | NXP USA Inc. | Datasheet | 261 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 32-VQFN Exposed Pad | YES | A/D 8x10b | 28 | 32768 | -40°C~85°C TA | Tray | 2009 | LPC1100L | Active | 3 (168 Hours) | 33 | QUAD | NO LEAD | 3.3V | 0.65mm | LPC1114 | 32 | S-PQCC-N32 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No LPC2148FBD64,151 | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 14x10b; D/A 1x10b | 45 | 524288 | -40°C~85°C TA | Tray | 2003 | LPC2100 | e3 | Not For New Designs | 1 (Unlimited) | 64 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC214* | 64 | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 40K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | NO | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||
![]() | Mfr Part No MCF5272VM66 | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 196-LBGA | YES | 32 | 0°C~70°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 196 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5272 | S-PBGA-B196 | Not Qualified | 3.6V | 3V | External | 66MHz | 1K x 32 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 66MHz | ROM | 32-Bit | 16KB 4K x 32 | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 23 | YES | YES | 32 | FIXED POINT | YES | 1.75mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||
Mfr Part No LPC1313FBD48/01,15 | NXP USA Inc. | Datasheet | 201 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 42 | 32768 | -40°C~85°C TA | Tray | 2009 | LPC13xx | e3 | Active | 1 (Unlimited) | 48 | EAR99 | Matte Tin (Sn) | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | LPC1313 | 48 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 2V | Internal | 72MHz | 8K x 8 | 2V~3.6V | MICROCONTROLLER | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, UART/USART | 32 | YES | NO | NO | NO | 8 | CORTEX-M3 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||
![]() | Mfr Part No MC9S08GT8ACFDE | NXP USA Inc. | Datasheet | 392 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | 8192 | -40°C~85°C TA | Tray | 2006 | S08 | Active | 3 (168 Hours) | 48 | EAR99 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08GT8 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||
![]() | Mfr Part No LPC11U14FET48/201, | NXP USA Inc. | Datasheet | 322 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-TFBGA | YES | A/D 8x10b | 40 | 32768 | -40°C~85°C TA | Tray | 2009 | LPC11Uxx | Active | 1 (Unlimited) | 48 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 0.5mm | LPC11U | S-PBGA-B48 | 3.6V | 1.8V | Internal | 50MHz | 6K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | 32 | YES | NO | NO | NO | 8 | 1.1mm | 4.5mm | 4.5mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MC9S08GT16ACFCER | NXP USA Inc. | Datasheet | 24 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 4x10b | 24 | 16348 | -40°C~85°C TA | Tape & Reel (TR) | 2012 | S08 | Active | 3 (168 Hours) | 32 | EAR99 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08GT16 | S-PQCC-N32 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||
![]() | Mfr Part No MCF52233CVM60 | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 121-LBGA | YES | A/D 8x12b | 73 | 262144 | -40°C~85°C TA | Tray | 2004 | MCF5223x | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF52233 | S-PBGA-B121 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 256KB 256K x 8 | Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||
![]() | Mfr Part No MCF52223CVM66 | NXP USA Inc. | Datasheet | 17 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 81-LBGA | YES | A/D 8x12b | 56 | 262144 | -40°C~85°C TA | Tray | 2005 | MCF5222x | e1 | Active | 3 (168 Hours) | 81 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF52223 | S-PBGA-B81 | Not Qualified | 3.6V | 3/3.3V | 3V | Internal | 66MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||
![]() | Mfr Part No MIMXRT1061CVL5A | NXP USA Inc. | Datasheet | 17 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 196-LFBGA | YES | A/D 20x12b | 127 | -40°C~105°C TJ | Tray | RT1060 | Active | 3 (168 Hours) | 196 | BOTTOM | BALL | 0.65mm | S-PBGA-B196 | 1.26V | 1.15V | Internal/External | 528MHz | 1M x 8 | 3V~3.6V | MICROPROCESSOR, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | External Program Memory | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | 13 | YES | YES | 16 | FLOATING POINT | YES | 1.52mm | 10mm | 10mm | |||||||||||||||||||||||||||
![]() | Mfr Part No P87C51SBPN,112 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 40-DIP (0.600, 15.24mm) | NO | 32 | 4096 | 0°C~70°C TA | Tube | 2011 | 87C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | 8542.31.00.01 | DUAL | NOT SPECIFIED | 5V | 2.54mm | NOT SPECIFIED | P87C51 | 40 | R-PDIP-T40 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 16MHz | OTP | 8-Bit | 4KB 4K x 8 | EBI/EMI, UART/USART | 50mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | |||||||||||||
![]() | Mfr Part No P87C51SBAA,512 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | YES | 32 | 4096 | 0°C~70°C TA | Tube | 2011 | 87C | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 30 | P87C51 | 44 | S-PQCC-J44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 16MHz | OTP | 8-Bit | 4KB 4K x 8 | EBI/EMI, UART/USART | 50mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.57mm | 16.585mm | 16.585mm | ROHS3 Compliant | ||||||||||||
![]() | Mfr Part No P80C554SFBD,157 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-LQFP | YES | A/D 7x10b | 40 | 0 | -40°C~85°C TA | Tray | 2003 | 80C | e3 | Obsolete | 1 (Unlimited) | 64 | Tin (Sn) | OPERATES AT 3V MIN SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 30 | P80C554 | 64 | S-PQFP-G64 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 16MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 16MHz | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | 32mA | 8 | YES | NO | YES | NO | 16 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||
![]() | Mfr Part No MCHC908JW32FC | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | 29 | 0°C~70°C TA | Tray | 1996 | HC08 | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 5V | 0.5mm | 40 | MCHC908JW32 | S-XQCC-N48 | Not Qualified | 5.5V | 3.5V | Internal | 8MHz | 1K x 8 | 3.5V~5.5V | MICROCONTROLLER | LED, LVD, POR, PWM | 4MHz | FLASH | 8-Bit | 32KB 32K x 8 | SPI, USB | 8 | NO | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MC9S08QG4CFKE | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 8x10b | 12 | 4096 | -40°C~85°C TA | Tray | 2009 | S08 | Active | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QG4 | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 4mm | 4mm | ROHS3 Compliant | ||||||||||||||||
![]() | Mfr Part No MC11E1CPBE2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 52-LQFP | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tray | 2005 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC11E1 | S-PQFP-G52 | 5.5V | 4.5V | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 1.7mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||
![]() | Mfr Part No MCF5213LCVM80 | NXP USA Inc. | Datasheet | 960 | - | Min: 1 Mult: 1 | Surface Mount | 81-LBGA | YES | A/D 8x12b | 56 | -40°C~85°C TA | Tray | 2002 | MCF521x | e1 | Not For New Designs | 3 (168 Hours) | 81 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5213 | S-PBGA-B81 | Not Qualified | 3.6V | 3V | Internal | 80MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||
![]() | Mfr Part No LPC1112FHN33/101,5 | NXP USA Inc. | Datasheet | 392 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 32-VQFN Exposed Pad | YES | A/D 8x10b | 28 | 16384 | -40°C~85°C TA | Tray | 2009 | LPC1100 | Active | 3 (168 Hours) | 33 | QUAD | NO LEAD | 3.3V | 0.65mm | LPC1112 | 32 | S-PQCC-N32 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No LPC1113FHN33/202,5 | NXP USA Inc. | Datasheet | 11 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 32-VQFN Exposed Pad | YES | A/D 8x10b | 28 | 24576 | -40°C~85°C TA | Tray | 2006 | LPC1100L | Active | 3 (168 Hours) | 33 | QUAD | NO LEAD | 3.3V | 0.65mm | LPC1113 | 32 | S-PQCC-N32 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 24KB 24K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MC9S08SH4CWJ | NXP USA Inc. | Datasheet | 134 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 12x10b | 17 | 4096 | -40°C~85°C TA | Tube | 2010 | S08 | e3 | Active | 3 (168 Hours) | 20 | EAR99 | MATTE TIN | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08SH4 | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2.65mm | 12.8mm | 7.5mm | ROHS3 Compliant |
LPC1114FHN33/302:5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC2148FBD64,151
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF5272VM66
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC1313FBD48/01,15
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08GT8ACFDE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC11U14FET48/201,
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08GT16ACFCER
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF52233CVM60
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF52223CVM66
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MIMXRT1061CVL5A
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
P87C51SBPN,112
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
P87C51SBAA,512
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
P80C554SFBD,157
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCHC908JW32FC
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08QG4CFKE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC11E1CPBE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF5213LCVM80
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC1112FHN33/101,5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
LPC1113FHN33/202,5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MC9S08SH4CWJ
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
