The manufacturer is 'NXP'
- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
- All Manufacturers:
NXP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCF5307CAI66B | NXP USA Inc. | Datasheet | 2000 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 208-BFQFP | YES | 16 | -40°C~85°C TA | Tray | 1999 | MCF530x | e3 | Active | 3 (168 Hours) | 208 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 250 | 3.3V | 0.5mm | 30 | MCF5307 | S-PQFP-G208 | Not Qualified | 3.6V | 3.3V | 3V | External | 66MHz | 4K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, POR, WDT | 33.33MHz | ROMless | 32-Bit | EBI/EMI, I2C, UART/USART | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 4.1mm | 28mm | 28mm | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No MC9S08QG4CDNE | NXP USA Inc. | Datasheet | 5677 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | -40°C~85°C TA | Tube | 2003 | S08 | e3 | Active | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08QG4 | R-PDSO-G8 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No MCF5280CVM66 | NXP USA Inc. | Datasheet | 504 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b | 142 | -40°C~85°C TA | Tray | 2002 | MCF528x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5280 | S-PBGA-B256 | Not Qualified | 3.6V | 2.7V | External | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | YES | YES | YES | NO | 24 | 32 | FLASH | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No MC9S08PA8AVLC | NXP USA Inc. | Datasheet | 184 | - | Min: 1 Mult: 1 | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x12b | 28 | -40°C~105°C TA | Tray | 2011 | S08 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | 5.5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No MC908GZ32MFAE | NXP USA Inc. | Datasheet | 80 | - | Min: 1 Mult: 1 | Surface Mount | 48-LQFP | YES | A/D 24x10b | 37 | -40°C~125°C TA | Tray | 2007 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY @ 4MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908GZ32 | S-PQFP-G48 | Not Qualified | 5.5V | 4.5V | Internal | 8MHz | 1.5K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No SPC5742PK1AMLQ8R | NXP USA Inc. | Datasheet | 2000 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 64x12b | 79 | -40°C~125°C TA | Tape & Reel (TR) | 2010 | MPC57xx | Active | 3 (168 Hours) | 144 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | 3.6V | 3.15V | Internal | 180MHz | 192K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 32 | 64 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||
| Mfr Part No MC9S08DV60ACLC | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 10x12b | 25 | -40°C~85°C TA | Tray | S08 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08DV60 | S-PQFP-G32 | 5.5V | 2.7V | External | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No S9S08SG8E2MTGR | NXP USA Inc. | Datasheet | 2000 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | 512 | 8192 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 1999 | S08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||
 | Mfr Part No MKL24Z64VLK4 | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 14x12b | 66 | 65536 | -40°C~105°C TA | Tray | 2011 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1V | 0.5mm | 40 | MKL24Z64 | S-PQFP-G80 | Not Qualified | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No S912ZVL96F0MLF | NXP USA Inc. | Datasheet | 7710 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 48-LQFP | A/D 10x10b | 34 | -40°C~125°C TA | Tray | S12 MagniV | Active | 3 (168 Hours) | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S9S12P32J0VFT | NXP USA Inc. | Datasheet | 1040 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 32768 | Automotive grade | -40°C~105°C TA | Tray | 2006 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | NO LEAD | 260 | 5V | 0.5mm | 40 | S9S12P32 | S-XQCC-N48 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 2K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.05mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No MK20DX256VLK10R | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 52 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G80 | 3.6V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No MCF54416CMJ250 | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x12b; D/A 2x12b | 87 | -40°C~85°C TA | Tray | 2006 | MCF5441x | e2 | Active | 3 (168 Hours) | 256 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MCF54416 | S-PBGA-B256 | Not Qualified | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | 32 | YES | YES | FIXED POINT | YES | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No MC9RS08KB12CTG | NXP USA Inc. | Datasheet | 7 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 14 | 12288 | -40°C~85°C TA | Tube | 2009 | RS08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.635mm | 40 | MC9RS08KB12 | R-PDSO-G16 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 254 x 8 | 1.8V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 12KB 12K x 8 | I2C, SPI | 8 | YES | NO | YES | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No LPC11E67JBD100E | NXP USA Inc. | Datasheet | 143 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 12x12b | 80 | 131072 | -40°C~105°C TA | Tray | 2010 | LPC11Exx | Active | 3 (168 Hours) | 100 | QUAD | GULL WING | 3.3V | 0.5mm | 100 | S-PQFP-G100 | Not Qualified | 3.3V | Internal | 50MHz | 20K x 8 | 2.4V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | 4K x 8 | CORTEX-M0 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No MCF54451VM240 | NXP USA Inc. | Datasheet | 40 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | 132 | 0°C~70°C TA | Tray | 2006 | MCF5445x | e1 | Active | 3 (168 Hours) | 256 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF54451 | S-PBGA-B256 | Not Qualified | 1.65V | 1.51.82.53.3V | 1.35V | Internal | 240MHz | 32K x 8 | 1.35V~3.6V | MICROPROCESSOR, RISC | Coldfire V4 | DMA, WDT | 60MHz | ROMless | 32-Bit | I2C, SPI, SSI, UART/USART, USB OTG | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No MK10DN64VFT5 | NXP USA Inc. | Datasheet | 8004 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 16x16b | 33 | 65536 | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK10DN64 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No SPC5746BHK1AMKU6 | NXP USA Inc. | Datasheet | 160 | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 176-LQFP Exposed Pad | YES | A/D 36x10b, 16x12b | 129 | -40°C~125°C TA | Tray | MPC57xx | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 160MHz | 384K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MC9S08AC60CFDE | NXP USA Inc. | Datasheet | 36 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 38 | 63280 | -40°C~85°C TA | Tray | 2005 | S08 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 5V | 0.5mm | 40 | MC9S08AC60 | S-XQCC-N48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No S912ZVML12F3MKHR | NXP USA Inc. | Datasheet | 4200 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~125°C TA | Tape & Reel (TR) | S12 MagniV | Active | 3 (168 Hours) | Internal | 50MHz | 8K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant |
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MCF5307CAI66B
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9S08QG4CDNE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5280CVM66
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9S08PA8AVLC
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC908GZ32MFAE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5742PK1AMLQ8R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9S08DV60ACLC
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S9S08SG8E2MTGR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MKL24Z64VLK4
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S912ZVL96F0MLF
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S9S12P32J0VFT
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK20DX256VLK10R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF54416CMJ250
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9RS08KB12CTG
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC11E67JBD100E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF54451VM240
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK10DN64VFT5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5746BHK1AMKU6
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC9S08AC60CFDE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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S912ZVML12F3MKHR
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire