The manufacturer is 'NXP'
- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
- All Manufacturers:
NXP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCIMX6Y2DVM05AB | NXP USA Inc. | Datasheet | 8508 | - | Min: 1 Mult: 1 | 18 Weeks | 289-LFBGA | 0°C~95°C TJ | Tray | 2015 | i.MX6 | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 528MHz | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MVF61NS151CMK50 | NXP USA Inc. | Datasheet | 1160 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e2 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF61NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||||||
 | Mfr Part No MCIMX6U5DVM10AC | NXP USA Inc. | Datasheet | 40000 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6DL | e1 | Active | 3 (168 Hours) | 624 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No MCIMX6U5EVM10AC | NXP USA Inc. | Datasheet | 2835 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6DL | e1 | Active | 3 (168 Hours) | 624 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No MCIMX6Q6AVT10AD | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MCIMX6S5DVM10AC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6S | Active | 3 (168 Hours) | 624 | BOTTOM | BALL | 260 | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||
| Mfr Part No MCIMX6S6AVM08AC | NXP USA Inc. | Datasheet | 475 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCIMX6G3CVM05AB | NXP USA Inc. | Datasheet | 180 | - | Min: 1 Mult: 1 | 15 Weeks | 289-LFBGA | YES | 131 | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | Active | 3 (168 Hours) | 289 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | ARM® Cortex®-A7 | 16 | YES | 16 | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No MCIMX287CVM4B | NXP USA Inc. | Datasheet | 608 | - | Min: 1 Mult: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX287 | S-PBGA-B289 | 1.55V | 1.35V | 454MHz | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | 24MHz | YES | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | 1.37mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No MCIMX6S7CVM08AC | NXP USA Inc. | Datasheet | 3200 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6S | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | YES | YES | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No MCIMX6Q5EYM10AC | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 624-LFBGA, FCBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCIMX6S5DVM10AB | NXP USA Inc. | Datasheet | 35 | - | Min: 1 Mult: 1 | 624-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6S | Not For New Designs | 3 (168 Hours) | 624 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No MCIMX7D5EVM10SD | NXP USA Inc. | Datasheet | 18908 | - | Min: 1 Mult: 1 | 16 Weeks | 541-LFBGA | YES | -20°C~105°C TJ | Tray | 2012 | i.MX7D | Active | 3 (168 Hours) | 541 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.75mm | 40 | S-PBGA-B541 | 1.25V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.42mm | 19mm | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No MCIMX6Q7CVT08AD | NXP USA Inc. | Datasheet | 2800 | - | Min: 1 Mult: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No MPC5200CVR400B | NXP USA Inc. | Datasheet | 480 | - | Min: 1 Mult: 1 | 10 Weeks | 272-BBGA | YES | -40°C~85°C TA | Tray | 2003 | MPC52xx | e1 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | PC5200 | S-PBGA-B272 | 1.58V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC e300 | 35MHz | 13 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 2.65mm | 27mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No MCIMX6S5EVM10AC | NXP USA Inc. | Datasheet | 231 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6S | e1 | Active | 3 (168 Hours) | 624 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No P1011NXN2HFB | NXP USA Inc. | Datasheet | 108 | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | P1011 | S-PBGA-B689 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | FLOATING POINT | YES | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||
| Mfr Part No MCIMX6G2CVM05AB | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 15 Weeks | 289-LFBGA | YES | 131 | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | Active | 3 (168 Hours) | 289 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | ARM® Cortex®-A7 | 16 | YES | 16 | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||
| Mfr Part No MCIMX7D7DVM10SC | NXP USA Inc. | Datasheet | 128 | - | Min: 1 Mult: 1 | 18 Weeks | 541-LFBGA | YES | 0°C~95°C TJ | Tray | 2012 | i.MX7D | Active | 3 (168 Hours) | 541 | 8542.31.00.01 | BOTTOM | BALL | 1.1V | 0.75mm | S-PBGA-B541 | 1.25V | 1.045V | 1.0GHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A7, ARM® Cortex®-M4 | 16 | YES | 32 | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.4mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | Mfr Part No MPC8247CVRTIEA | NXP USA Inc. | Datasheet | 2284 | - | Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 133MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 2.55mm | 27mm | ROHS3 Compliant |
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MCIMX6Y2DVM05AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF61NS151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6U5DVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6U5EVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6Q6AVT10AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6S5DVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6S6AVM08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6G3CVM05AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX287CVM4B
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6S7CVM08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6Q5EYM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6S5DVM10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX7D5EVM10SD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6Q7CVT08AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC5200CVR400B
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6S5EVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1011NXN2HFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6G2CVM05AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX7D7DVM10SC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8247CVRTIEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire