The manufacturer is 'Xilinx'

    • Bus Compatibility
    • HTS Code
    • Ihs Manufacturer
    • JESD-30 Code
    • Length
    • Number of Terminals
    • Operating Temperature-Max
    • Package Body Material
    • Package Code
    • Package Equivalence Code
    • Package Shape
    • Package Style
    • All Manufacturers:

      Xilinx

    Image

    Part Number

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    RoHS

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    Terminal Pitch

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    JESD-30 Code

    Temperature Grade

    Speed

    RAM Size

    uPs/uCs/Peripheral ICs Type

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    Length

    Width

    SM-K26-XCL2GC

    Mfr Part No

    SM-K26-XCL2GC

    Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    Kria SOM Carrier Card

    Silicon Power Cube

    AMD Xilinx

    Box

    Active

    0°C ~ 85°C (TJ)

    Zynq® UltraScale+™ Kria™

    3.030 L x 2.360 W (77.00mm x 60.00mm)

    2 x 240 Pin

    533MHz, 1.333GHz

    4GB

    ARM® Cortex®-A53

    ARM

    FPGA Core

    16GB eMMC, 64MB QSPI

    Kria K26 System-on-Module XCK26-SFVC784-2LV-C

    Arm® Cortex®-R5F

    XCZU2CG-1LSFVA625I

    Mfr Part No

    XCZU2CG-1LSFVA625I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    625

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    FBGA

    BGA625,25X25,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B625

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.43 mm

    CAN, I2C, SPI, UART

    21 mm

    21 mm

    XCZU9CG-1LFFVC900I

    Mfr Part No

    XCZU9CG-1LFFVC900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.42 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU7CG-1LFBVB900I

    Mfr Part No

    XCZU7CG-1LFBVB900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

    8542.31.00.01

    BOTTOM

    BALL

    1 mm

    compliant

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    2.88 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU2EG-2LSBVA484E

    Mfr Part No

    XCZU2EG-2LSBVA484E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    484

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    FBGA

    BGA484,22X22,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B484

    OTHER

    PROGRAMMABLE SoC

    2.61 mm

    CAN, I2C, SPI, UART

    19 mm

    19 mm

    XCZU6EG-1LFFVC900I

    Mfr Part No

    XCZU6EG-1LFFVC900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.42 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU7EG-1LFFVC1156I

    Mfr Part No

    XCZU7EG-1LFFVC1156I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    1156

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA1156,34X34,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B1156

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.51 mm

    CAN, I2C, SPI, UART

    35 mm

    35 mm

    XCZU6EG-2LFFVC900E

    Mfr Part No

    XCZU6EG-2LFFVC900E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B900

    OTHER

    PROGRAMMABLE SoC

    3.42 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU3CG-2LSFVC784I

    Mfr Part No

    XCZU3CG-2LSFVC784I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    784

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    FBGA

    ,

    BGA784,28X28,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    TIN SILVER COPPER

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B784

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.32 mm

    CAN, I2C, SPI, UART

    23 mm

    23 mm

    XCZU4EV-2LFBVB900E

    Mfr Part No

    XCZU4EV-2LFBVB900E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

    8542.31.00.01

    BOTTOM

    BALL

    1 mm

    compliant

    S-PBGA-B900

    OTHER

    PROGRAMMABLE SoC

    2.88 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU7EV-1LFBVB900I

    Mfr Part No

    XCZU7EV-1LFBVB900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

    8542.31.00.01

    BOTTOM

    BALL

    1 mm

    compliant

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    2.88 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU4EG-2LSFVC784E

    Mfr Part No

    XCZU4EG-2LSFVC784E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    784

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    FBGA

    BGA784,28X28,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    TIN SILVER COPPER

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B784

    OTHER

    PROGRAMMABLE SoC

    3.32 mm

    CAN, I2C, SPI, UART

    23 mm

    23 mm

    XCZU19EG-2LFFVE1924E

    Mfr Part No

    XCZU19EG-2LFFVE1924E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    1924

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    BGA

    BGA1924,44X44,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B1924

    OTHER

    PROGRAMMABLE SoC

    3.71 mm

    CAN, I2C, SPI, UART

    45 mm

    45 mm

    XCZU4CG-2LFBVB900I

    Mfr Part No

    XCZU4CG-2LFBVB900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    ,

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    2.88 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU17EG-1LFFVE1924I

    Mfr Part No

    XCZU17EG-1LFFVE1924I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    1924

    2018-03-09

    XILINX INC

    4

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    BGA1924,44X44,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    245

    1 mm

    compliant

    30

    S-PBGA-B1924

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.71 mm

    CAN, I2C, SPI, UART

    45 mm

    45 mm

    XCZU2EG-2LSFVA625E

    Mfr Part No

    XCZU2EG-2LSFVA625E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    625

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    FBGA

    BGA625,25X25,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B625

    OTHER

    PROGRAMMABLE SoC

    3.43 mm

    CAN, I2C, SPI, UART

    21 mm

    21 mm

    XCZU9CG-2LFFVC900I

    Mfr Part No

    XCZU9CG-2LFFVC900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    XILINX INC

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    ,

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    8542.31.00.01

    BOTTOM

    BALL

    1 mm

    compliant

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.42 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm

    XCZU5EV-2LSFVC784E

    Mfr Part No

    XCZU5EV-2LSFVC784E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    784

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    FBGA

    BGA784,28X28,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B784

    OTHER

    PROGRAMMABLE SoC

    3.32 mm

    CAN, I2C, SPI, UART

    23 mm

    23 mm

    XCZU3EG-2LSFVA625E

    Mfr Part No

    XCZU3EG-2LSFVA625E

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    625

    2018-03-09

    XILINX INC

    4

    110 °C

    PLASTIC/EPOXY

    FBGA

    BGA625,25X25,32

    SQUARE

    GRID ARRAY, FINE PITCH

    Transferred

    Yes

    0.85 V

    e1

    Tin/Silver/Copper (Sn/Ag/Cu)

    8542.31.00.01

    BOTTOM

    BALL

    250

    0.8 mm

    compliant

    30

    S-PBGA-B625

    OTHER

    PROGRAMMABLE SoC

    3.43 mm

    CAN, I2C, SPI, UART

    21 mm

    21 mm

    XCZU6CG-2LFFVC900I

    Mfr Part No

    XCZU6CG-2LFFVC900I

    AMD Xilinx Datasheet

    -

    -

    Min: 1

    Mult: 1

    YES

    900

    XILINX INC

    100 °C

    -40 °C

    PLASTIC/EPOXY

    BGA

    ,

    BGA900,30X30,40

    SQUARE

    GRID ARRAY

    Transferred

    Yes

    0.85 V

    8542.31.00.01

    BOTTOM

    BALL

    1 mm

    compliant

    S-PBGA-B900

    INDUSTRIAL

    PROGRAMMABLE SoC

    3.42 mm

    CAN, I2C, SPI, UART

    31 mm

    31 mm