The manufacturer is 'Xilinx'
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Xilinx
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | For Use With | Ihs Manufacturer | Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Rohs Code | Supply Voltage-Nom | Operating Temperature | Series | Size / Dimension | JESD-609 Code | Connector Type | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Temperature Grade | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Seated Height-Max | Core Architecture | Bus Compatibility | Module/Board Type | Flash Size | Kit Contents | Co-Processor | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No SM-K26-XCL2GC | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Kria SOM Carrier Card | Silicon Power Cube | AMD Xilinx | Box | Active | 0°C ~ 85°C (TJ) | Zynq® UltraScale+™ Kria™ | 3.030 L x 2.360 W (77.00mm x 60.00mm) | 2 x 240 Pin | 533MHz, 1.333GHz | 4GB | ARM® Cortex®-A53 | ARM | FPGA Core | 16GB eMMC, 64MB QSPI | Kria K26 System-on-Module XCK26-SFVC784-2LV-C | Arm® Cortex®-R5F | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-1LSFVA625I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU9CG-1LFFVC900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU7CG-1LFBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||
![]() | Mfr Part No XCZU2EG-2LSBVA484E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU6EG-1LFFVC900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU7EG-1LFFVC1156I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU6EG-2LFFVC900E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-2LSFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU4EV-2LFBVB900E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||
![]() | Mfr Part No XCZU7EV-1LFBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||
![]() | Mfr Part No XCZU4EG-2LSFVC784E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-2LFFVE1924E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1924 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1924 | OTHER | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 45 mm | 45 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU4CG-2LFBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU17EG-1LFFVE1924I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1924 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1924 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 45 mm | 45 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU2EG-2LSFVA625E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2LFFVC900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-2LSFVC784E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-2LSFVA625E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | 2018-03-09 | XILINX INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-2LFFVC900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm |
SM-K26-XCL2GC
Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU2CG-1LSFVA625I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU9CG-1LFFVC900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU7CG-1LFBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU2EG-2LSBVA484E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU6EG-1LFFVC900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU7EG-1LFFVC1156I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU6EG-2LFFVC900E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU3CG-2LSFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU4EV-2LFBVB900E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU7EV-1LFBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU4EG-2LSFVC784E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU19EG-2LFFVE1924E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU4CG-2LFBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU17EG-1LFFVE1924I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU2EG-2LSFVA625E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU9CG-2LFFVC900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU5EV-2LSFVC784E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU3EG-2LSFVA625E
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
XCZU6CG-2LFFVC900I
AMD Xilinx
Package:Embedded - Microcontrollers
Price: please inquire
