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      Home / All Manufacturers / Xilinx / Embedded - Microcontrollers /

      The manufacturer is 'Xilinx'

        • Bus Compatibility
        • HTS Code
        • Ihs Manufacturer
        • JESD-30 Code
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        • Number of Terminals
        • Operating Temperature-Max
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        • Package Code
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        • All Manufacturers:

          Xilinx

        Image

        Part Number

        Manufacturer

        Datasheet

        Availability

        Pricing(USD)

        Quantity

        RoHS

        Surface Mount

        Number of Terminals

        Date Of Intro

        Ihs Manufacturer

        Moisture Sensitivity Levels

        Operating Temperature-Max

        Operating Temperature-Min

        Package Body Material

        Package Code

        Package Description

        Package Equivalence Code

        Package Shape

        Package Style

        Part Life Cycle Code

        Rohs Code

        Supply Voltage-Nom

        JESD-609 Code

        Terminal Finish

        HTS Code

        Terminal Position

        Terminal Form

        Peak Reflow Temperature (Cel)

        Terminal Pitch

        Reach Compliance Code

        Time@Peak Reflow Temperature-Max (s)

        JESD-30 Code

        Temperature Grade

        uPs/uCs/Peripheral ICs Type

        Seated Height-Max

        Bus Compatibility

        Length

        Width
        XCZU17EG-1LFFVB1517I

        Mfr Part No

        XCZU17EG-1LFFVB1517I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1517

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1517,39X39,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1517

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.51 mm

        CAN, I2C, SPI, UART

        40 mm

        40 mm

        XCZU6CG-1LFFVB1156I

        Mfr Part No

        XCZU6CG-1LFFVB1156I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1156

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1156,34X34,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1156

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.42 mm

        CAN, I2C, SPI, UART

        35 mm

        35 mm

        XCZU11EG-1LFFVC1760I

        Mfr Part No

        XCZU11EG-1LFFVC1760I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1760

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1760,42X42,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1760

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.71 mm

        CAN, I2C, SPI, UART

        42.5 mm

        42.5 mm

        XCZU19EG-1LFFVB1517I

        Mfr Part No

        XCZU19EG-1LFFVB1517I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1517

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1517,39X39,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1517

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.51 mm

        CAN, I2C, SPI, UART

        40 mm

        40 mm

        XCZU2EG-2LSFVC784E

        Mfr Part No

        XCZU2EG-2LSFVC784E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        784

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        FBGA

        BGA784,28X28,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        TIN SILVER COPPER

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B784

        OTHER

        PROGRAMMABLE SoC

        3.32 mm

        CAN, I2C, SPI, UART

        23 mm

        23 mm

        XCZU3CG-1LSFVA625I

        Mfr Part No

        XCZU3CG-1LSFVA625I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        625

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        BGA625,25X25,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B625

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.43 mm

        CAN, I2C, SPI, UART

        21 mm

        21 mm

        XCZU2EG-1LSFVA625I

        Mfr Part No

        XCZU2EG-1LSFVA625I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        625

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        BGA625,25X25,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B625

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.43 mm

        CAN, I2C, SPI, UART

        21 mm

        21 mm

        XCZU3EG-2LSFVA625I

        Mfr Part No

        XCZU3EG-2LSFVA625I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        625

        XILINX INC

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        ,

        BGA625,25X25,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        8542.31.00.01

        BOTTOM

        BALL

        0.8 mm

        compliant

        S-PBGA-B625

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.43 mm

        CAN, I2C, SPI, UART

        21 mm

        21 mm

        XCZU19EG-2LFFVC1760E

        Mfr Part No

        XCZU19EG-2LFFVC1760E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1760

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA1760,42X42,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1760

        OTHER

        PROGRAMMABLE SoC

        3.71 mm

        CAN, I2C, SPI, UART

        42.5 mm

        42.5 mm

        XCZU5EG-1LSFVC784I

        Mfr Part No

        XCZU5EG-1LSFVC784I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        784

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        BGA784,28X28,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B784

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.32 mm

        CAN, I2C, SPI, UART

        23 mm

        23 mm

        XCZU6EG-1LFFVB1156I

        Mfr Part No

        XCZU6EG-1LFFVB1156I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1156

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1156,34X34,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1156

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.42 mm

        CAN, I2C, SPI, UART

        35 mm

        35 mm

        XCZU11EG-2LFFVC1156E

        Mfr Part No

        XCZU11EG-2LFFVC1156E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1156

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA1156,34X34,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1156

        OTHER

        PROGRAMMABLE SoC

        3.51 mm

        CAN, I2C, SPI, UART

        35 mm

        35 mm

        XCZU9CG-2LFFVB1156E

        Mfr Part No

        XCZU9CG-2LFFVB1156E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1156

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA1156,34X34,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1156

        OTHER

        PROGRAMMABLE SoC

        3.42 mm

        CAN, I2C, SPI, UART

        35 mm

        35 mm

        XCZU2CG-2LSFVC784E

        Mfr Part No

        XCZU2CG-2LSFVC784E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        784

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        FBGA

        BGA784,28X28,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        TIN SILVER COPPER

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B784

        OTHER

        PROGRAMMABLE SoC

        3.32 mm

        CAN, I2C, SPI, UART

        23 mm

        23 mm

        XCZU17EG-2LFFVB1517E

        Mfr Part No

        XCZU17EG-2LFFVB1517E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1517

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA1517,39X39,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1517

        OTHER

        PROGRAMMABLE SoC

        3.51 mm

        CAN, I2C, SPI, UART

        40 mm

        40 mm

        XCZU19EG-2LFFVB1517E

        Mfr Part No

        XCZU19EG-2LFFVB1517E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1517

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA1517,39X39,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1517

        OTHER

        PROGRAMMABLE SoC

        3.51 mm

        CAN, I2C, SPI, UART

        40 mm

        40 mm

        XCZU19EG-1LFFVE1924I

        Mfr Part No

        XCZU19EG-1LFFVE1924I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        1924

        2018-03-09

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        BGA

        BGA1924,44X44,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn/Ag/Cu)

        8542.31.00.01

        BOTTOM

        BALL

        245

        1 mm

        compliant

        30

        S-PBGA-B1924

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.71 mm

        CAN, I2C, SPI, UART

        45 mm

        45 mm

        XCZU4CG-2LFBVB900E

        Mfr Part No

        XCZU4CG-2LFBVB900E

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        900

        2018-03-09

        XILINX INC

        4

        110 °C

        PLASTIC/EPOXY

        BGA

        BGA900,30X30,40

        SQUARE

        GRID ARRAY

        Transferred

        Yes

        0.85 V

        e1

        Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

        8542.31.00.01

        BOTTOM

        BALL

        1 mm

        compliant

        S-PBGA-B900

        OTHER

        PROGRAMMABLE SoC

        2.88 mm

        CAN, I2C, SPI, UART

        31 mm

        31 mm

        XCZU2EG-2LSFVC784I

        Mfr Part No

        XCZU2EG-2LSFVC784I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        784

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        ,

        BGA784,28X28,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        TIN SILVER COPPER

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B784

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.32 mm

        CAN, I2C, SPI, UART

        23 mm

        23 mm

        XCZU5CG-2LSFVC784I

        Mfr Part No

        XCZU5CG-2LSFVC784I

        		AMD Xilinx Datasheet

        -

        -

        Min: 1

        Mult: 1

        YES

        784

        XILINX INC

        4

        100 °C

        -40 °C

        PLASTIC/EPOXY

        FBGA

        ,

        BGA784,28X28,32

        SQUARE

        GRID ARRAY, FINE PITCH

        Transferred

        Yes

        0.85 V

        e1

        TIN SILVER COPPER

        8542.31.00.01

        BOTTOM

        BALL

        250

        0.8 mm

        compliant

        30

        S-PBGA-B784

        INDUSTRIAL

        PROGRAMMABLE SoC

        3.32 mm

        CAN, I2C, SPI, UART

        23 mm

        23 mm