The manufacturer is 'Xilinx'
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Xilinx
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No XCZU6CG-1SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||
![]() | Mfr Part No XCZU6CG-L1SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||
![]() | Mfr Part No XCZU5EV-3SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm | |||||||
![]() | Mfr Part No XCZU6CG-1FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA900,30X30,40 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||
![]() | Mfr Part No XCZU11EG-3FFVB1517I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | |||||||||
![]() | Mfr Part No XCZU4EG-3SFVC784I | AMD Xilinx | Datasheet | 64 | - | Min: 1 Mult: 1 | YES | 784 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm | |||||||
![]() | Mfr Part No XCZU9CG-L1SFVA625I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA625,25X25,32 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||||||||
![]() | Mfr Part No XCZU6EG-3FFVB1156I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | 35 mm | 35 mm | |||||||||
![]() | Mfr Part No XCZU19EG-3FFVE1924I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1924 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1924 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 45 mm | 45 mm | |||||||||
![]() | Mfr Part No XCZU9CG-1SBVA484E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||||||||||
![]() | Mfr Part No XCZU19EG-3FFVC1760I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||
![]() | Mfr Part No XCZU6CG-1SFVC784E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||
![]() | Mfr Part No XCZU9CG-2SBVA484I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||
![]() | Mfr Part No XCZU9CG-1SBVA484I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||
![]() | Mfr Part No XQ7Z030-2RF900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | Not Qualified | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | |||||||||||||
![]() | Mfr Part No XQ7Z030-1RF900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | Not Qualified | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | |||||||||||||
![]() | Mfr Part No XCZU6CG-2SBVA484E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||||||||||
![]() | Mfr Part No XCZU4EV-3SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm | |||||||
![]() | Mfr Part No XCZU7EV-3FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | 31 mm | 31 mm | |||||||
![]() | Mfr Part No XCZU3EG-3SFVA625E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | XILINX INC | 4 | 100 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC |
XCZU6CG-1SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-L1SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU5EV-3SFVC784I
AMD Xilinx
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XCZU6CG-1FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU11EG-3FFVB1517I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU4EG-3SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU9CG-L1SFVA625I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU6EG-3FFVB1156I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU19EG-3FFVE1924I
AMD Xilinx
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XCZU9CG-1SBVA484E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVC1760I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU6CG-1SFVC784E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2SBVA484I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU9CG-1SBVA484I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XQ7Z030-2RF900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XQ7Z030-1RF900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-2SBVA484E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU4EV-3SFVC784I
AMD Xilinx
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XCZU7EV-3FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
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XCZU3EG-3SFVA625E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
