Xilinx - Memory - Modules - Richard Electronics

The manufacturer is 'Xilinx'

HTS Code
Memory Width
Organization
Surface Mount
Temperature Grade
Terminal Form
Terminal Pitch
Terminal Position
Clock Frequency-Max (fCLK)
ECCN Code
I/O Type
Ihs Manufacturer

All Manufacturers:
Xilinx

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Package / Case	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Memory Types	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Rohs Code	Supply Voltage-Nom (Vsup)	Published	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Memory Width	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Endurance	Data Retention Time-Min	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status	Lead Free
Mfr Part No XCCACEM64-BG388I	Xilinx Inc.	Datasheet	-	-	Min: 1 Mult: 1	388-BBGA	YES	388					FLASH															1999	e0	Obsolete	3 (168 Hours)	388		TIN LEAD	85°C	-40°C	8542.32.00.71	BOTTOM	BALL		1	1.8V	1.27mm		133MHz		388			1.89V	1.83.3V	INDUSTRIAL	1.71V	64MB			4MX16		16		67108864 bit		SERIAL				1000000 Write/Erase Cycles		2.87mm	35mm	35mm	No	Non-RoHS Compliant	Contains Lead
Mfr Part No XCCACEM32-BG388I	Xilinx Inc.	Datasheet	-	-	Min: 1 Mult: 1	388-BBGA	YES	388					FLASH															1999	e0	Obsolete	3 (168 Hours)	388		TIN LEAD	85°C	-40°C	8542.32.00.71	BOTTOM	BALL	225	1	1.8V	1.27mm		133MHz		388			1.89V	1.83.3V	INDUSTRIAL	1.71V	32MB			2MX16		16		33554432 bit		SERIAL				1000000 Write/Erase Cycles	20	2.87mm	35mm	35mm	No	Non-RoHS Compliant	Contains Lead
Mfr Part No XC1764-CD8M	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		2.5 MHz	XILINX INC			65536 words	64000	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	unknown				R-XDIP-T8	Not Qualified			MILITARY				0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC1765ELPC2OC	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		20		2.5 MHz	XILINX INC			65536 words	64000	70 °C		PLASTIC/EPOXY	QCCJ		LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	3.3 V						EAR99				8542.32.00.71	QUAD	J BEND				1.27 mm	not_compliant				S-PQCC-J20	Not Qualified			COMMERCIAL				0.005 mA	64KX1	3-STATE	1	0.00005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC17256L-DD8R	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		10 MHz	XILINX INC			262144 words	256000	125 °C	-55 °C	CERAMIC	DIP		DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	not_compliant				R-XDIP-T8	Not Qualified			MILITARY				0.005 mA	256KX1	3-STATE	1	0.00005 A	262144 bit	38535Q/M;38534H;883B		COMMON	CONFIGURATION MEMORY
Mfr Part No XC1718D-DD8R	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		5 MHz	XILINX INC			18144 words	18144	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	unknown				R-XDIP-T8	Not Qualified			MILITARY				0.01 mA	18144X1	3-STATE	1	0.0015 A		38535Q/M;38534H;883B		COMMON	CONFIGURATION MEMORY
Mfr Part No XC17128D-DD8R	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		12.5 MHz	XILINX INC			131072 words	128000	125 °C	-55 °C	CERAMIC	DIP		DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	not_compliant				R-XDIP-T8	Not Qualified			MILITARY				0.01 mA	128KX1	3-STATE	1	0.00005 A	131072 bit	38535Q/M;38534H;883B		COMMON	CONFIGURATION MEMORY
Mfr Part No XC17256L-DD8I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8	55 ns	10 MHz	XILINX INC			262144 words	1000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE		1		2.54 mm	unknown				R-XDIP-T8	Not Qualified			INDUSTRIAL			SYNCHRONOUS	0.01 mA	1KX8	3-STATE	8	0.00005 A	8192 bit		PARALLEL	COMMON	OTP ROM
Mfr Part No XC1718-PD8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		5 MHz	XILINX INC		1	18144 words	18144	70 °C		PLASTIC/EPOXY	DIP		DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	DUAL	THROUGH-HOLE	225			2.54 mm	not_compliant		30		R-PDIP-T8	Not Qualified			COMMERCIAL					18144X1	3-STATE	1					COMMON	CONFIGURATION MEMORY	15 V
Mfr Part No XC17256L-SO8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		8	65 ns	10 MHz	XILINX INC		3	262144 words	8000	70 °C		PLASTIC/EPOXY	SOP		SOP8,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	DUAL	GULL WING	225	1		1.27 mm	not_compliant		30		R-PDSO-G8	Not Qualified			COMMERCIAL			SYNCHRONOUS	0.01 mA	8KX8	3-STATE	8	0.00005 A	65536 bit		PARALLEL	COMMON	OTP ROM
Mfr Part No XC1764-PC20I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		20		2.5 MHz	XILINX INC		3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ		LDCC20,.4SQ	SQUARE	CHIP CARRIER	Obsolete	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	QUAD	J BEND	225			1.27 mm	not_compliant		30		S-PQCC-J20	Not Qualified			INDUSTRIAL				0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC1718-PC20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		20		5 MHz	XILINX INC		3	18144 words	18144	70 °C		PLASTIC/EPOXY	QCCJ		LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	QUAD	J BEND	225			1.27 mm	not_compliant		30		S-PQCC-J20	Not Qualified			COMMERCIAL					18144X1	3-STATE	1					COMMON	CONFIGURATION MEMORY	15 V
Mfr Part No XC1764-PC20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		20		2.5 MHz	XILINX INC		3	65536 words	64000	70 °C		PLASTIC/EPOXY	QCCJ		LDCC20,.4SQ	SQUARE	CHIP CARRIER	Obsolete	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	QUAD	J BEND	225			1.27 mm	not_compliant		30		S-PQCC-J20	Not Qualified			COMMERCIAL				0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC1765EPC2OC	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		20		10 MHz	XILINX INC			65536 words	64000	70 °C		PLASTIC/EPOXY	QCCJ		LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	5 V						EAR99				8542.32.00.71	QUAD	J BEND				1.27 mm	not_compliant				S-PQCC-J20	Not Qualified			COMMERCIAL				0.01 mA	64KX1	3-STATE	1	0.00005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC1765L-DD8R	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		2.5 MHz	XILINX INC			65536 words	64000	125 °C	-55 °C	CERAMIC	DIP		DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	not_compliant				R-XDIP-T8	Not Qualified			MILITARY				0.005 mA	64KX1	3-STATE	1	0.0015 A	65536 bit	38535Q/M;38534H;883B		COMMON	CONFIGURATION MEMORY
Mfr Part No XC1765L-DD8M	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		2.5 MHz	XILINX INC			65536 words	64000	125 °C	-55 °C	CERAMIC	DIP		DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	not_compliant				R-XDIP-T8	Not Qualified			MILITARY				0.005 mA	64KX1	3-STATE	1	0.0015 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC1718L-DD8I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		2.5 MHz	XILINX INC			18144 words	18144	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	3.3 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	unknown				R-XDIP-T8	Not Qualified			INDUSTRIAL				0.005 mA	18144X1	3-STATE	1	0.0015 A				COMMON	CONFIGURATION MEMORY
Mfr Part No XC17128L-DD8I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8	45 ns	10 MHz	XILINX INC			131072 words	2000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE		1		2.54 mm	unknown				R-XDIP-T8	Not Qualified			INDUSTRIAL			SYNCHRONOUS	0.01 mA	2KX8	3-STATE	8	0.00005 A	16384 bit		PARALLEL	COMMON	OTP ROM
Mfr Part No XC1764-CD8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		NO		8		2.5 MHz	XILINX INC			65536 words	64000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V						EAR99				8542.32.00.71	DUAL	THROUGH-HOLE				2.54 mm	unknown				R-XDIP-T8	Not Qualified			INDUSTRIAL				0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit			COMMON	CONFIGURATION MEMORY
Mfr Part No XC17256D-SO8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1		YES		8	200 ns	12 MHz	XILINX INC		3	262144 words	256000	70 °C		PLASTIC/EPOXY	SOP		SOP8,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	No	5 V		e0				EAR99	TIN LEAD			8542.32.00.71	DUAL	GULL WING	225	1		1.27 mm	not_compliant		30		R-PDSO-G8	Not Qualified	5.5 V		COMMERCIAL	4.5 V		ASYNCHRONOUS	0.01 mA	256KX8	3-STATE	8	0.00005 A	2097152 bit		PARALLEL	COMMON	OTP ROM