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NXP MF1ICS7001W/V9D
MF1ICS7001W/V9D
AGHF-MF1ICS7001W/V9D
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Technical Specifications
- TypeParameterSelect All
Contact Plating
Tin
Housing Material
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Factory Pack QuantityFactory Pack Quantity
1500
Mounting Styles
PCB Mount
Contact Materials
Brass
Manufacturer
TE Connectivity
Brand
TE Connectivity
Package Description
, WAFER
Package Equivalence Code
WAFER
Operating Temperature-Min
-25 °C
Operating Temperature-Max
70 °C
Manufacturer Part Number
MF1ICS7001W/V9D
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Risk Rank
5.84
Number of Positions
12 Position
Applications
Power, Signal
Number of Rows
1 Row
Subcategory
Headers & Wire Housings
Pitch
1.25 mm
Reach Compliance Code
unknown
Termination Style
Solder Pin
Qualification Status
Not Qualified
Contact Gender
Pin (Male)
Housing Color
Black
Temperature Grade
OTHER
uPs/uCs/Peripheral ICs Type
Product Type
Headers & Wire Housings
Product
Headers
Mounting Angle
Right Angle
Product Category
Headers & Wire Housings
Flammability Rating
UL 94 V-0
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