M1AFS1500-1FGG484 alternative parts: M1AFS600-1FG484
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Mfr.'s Part #: | ||
Manufacturer: | ||
Category: | ||
Datasheet: | - | - |
Inventory count: | please inquire | please inquire |
Pricing(USD): | please inquire | please inquire |
Description: | FPGA - Field Programmable Gate Array M1AFS1500-1FGG484 | FPGA - Field Programmable Gate Array M1AFS600-1FG484 |
Rohs: | ||
Lifecycle Status: | Production (Last Updated: 1 month ago) | - |
Package / Case: | FBGA | FBGA |
Mount: | Surface Mount | - |
Mounting Type: | Surface Mount | Surface Mount |
Surface Mount: | YES | YES |
Number of Pins: | 484 | - |
Supplier Device Package: | 484-FPBGA (23x23) | 484-FPBGA (23x23) |
Weight: | 400.011771 mg | - |
Number of Terminals: | 484 | 484 |
RoHS: | Details | N |
Number of I/Os: | 223 I/O | 172 I/O |
Supply Voltage-Min: | 1.425 V | 1.425 V |
Minimum Operating Temperature: | 0 C | 0 C |
Maximum Operating Temperature: | + 70 C | + 70 C |
Mounting Styles: | SMD/SMT | SMD/SMT |
Maximum Operating Frequency: | 1282.05 MHz | 1282.05 MHz |
Moisture Sensitive: | Yes | Yes |
Factory Pack QuantityFactory Pack Quantity: | 60 | 60 |
Tradename: | Fusion | Fusion |
Unit Weight: | 0.014110 oz | 0.014110 oz |
Supply Voltage-Max: | 1.575 V | 1.575 V |
Package: | Tray | Tray |
Base Product Number: | M1AFS1500 | M1AFS600 |
Mfr: | Microchip Technology | Microchip Technology |
Product Status: | Active | Active |
Package Description: | FBGA-484 | BGA, |
Package Style: | GRID ARRAY | GRID ARRAY |
Moisture Sensitivity Levels: | 3 | 3 |
Package Body Material: | PLASTIC/EPOXY | PLASTIC/EPOXY |
Supply Voltage-Nom: | 1.5 V | 1.5 V |
Reflow Temperature-Max (s): | 40 | 30 |
Operating Temperature-Max: | 85 °C | 85 °C |
Rohs Code: | Yes | No |
Manufacturer Part Number: | M1AFS1500-1FGG484 | M1AFS600-1FG484 |
Package Code: | BGA | BGA |
Package Shape: | SQUARE | SQUARE |
Part Life Cycle Code: | Active | Active |
Ihs Manufacturer: | MICROSEMI CORP | MICROSEMI CORP |
Risk Rank: | 5.3 | 5.3 |
Series: | M1AFS1500 | M1AFS600 |
Packaging: | Tray | Tray |
Operating Temperature: | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
JESD-609 Code: | e1 | e0 |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) |
Max Operating Temperature: | 70 °C | - |
Min Operating Temperature: | 0 °C | - |
HTS Code: | 8542.39.00.01 | 8542.39.00.01 |
Technology: | CMOS | CMOS |
Voltage - Supply: | 1.5 V | 1.5 V |
Terminal Position: | BOTTOM | BOTTOM |
Terminal Form: | BALL | BALL |
Peak Reflow Temperature (Cel): | 250 | 225 |
Terminal Pitch: | 1 mm | 1 mm |
Reach Compliance Code: | compliant | compliant |
JESD-30 Code: | S-PBGA-B484 | S-PBGA-B484 |
Qualification Status: | Not Qualified | Not Qualified |
Temperature Grade: | OTHER | OTHER |
RAM Size: | 33.8 kB | - |
Organization: | 38400 CLBS, 1500000 GATES | 13824 CLBS, 600000 GATES |
Seated Height-Max: | 2.44 mm | 2.44 mm |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Total RAM Bits: | 276480 | 110592 |
Number of Gates: | 1500000 | 600000 |
Max Frequency: | 1.28205 GHz | - |
Speed Grade: | 1 | 1 |
Number of Registers: | 38400 | - |
Number of CLBs: | 38400 | 13824 |
Voltage - Supply (Max): | 1.575 V | - |
Voltage - Supply (Min): | 1.425 V | - |
Number of Equivalent Gates: | 1500000 | 600000 |
Height: | 1.73 mm | 1.73 mm |
Length: | 23 mm | 23 mm |
Width: | 23 mm | 23 mm |
Radiation Hardening: | No | - |
Shipping Restrictions: | - | This product may require additional documentation to export from the United States. |
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