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M1AGL1000V5-FG256 alternative parts: A3P1000-FGG256M
 RFQ RFQ | RFQ RFQ | |
Mfr.'s Part #: | ||
Manufacturer: | ||
Category: | ||
Datasheet: | - | - |
Inventory count: | please inquire | please inquire |
Pricing(USD): | please inquire | please inquire |
Description: | FPGA - Field Programmable Gate Array M1AGL1000V5-FG256 | FPGA - Field Programmable Gate Array A3P1000-FGG256M |
Rohs: | ||
Lifecycle Status: | Production (Last Updated: 2 months ago) | - |
Package / Case: | FPBGA-256 | FBGA-256 |
Mount: | Surface Mount | - |
Mounting Type: | Surface Mount | Surface Mount |
Surface Mount: | YES | - |
Number of Pins: | 256 | - |
Supplier Device Package: | 256-FPBGA (17x17) | 256-FBGA (17x17) |
Number of Terminals: | 256 | - |
Shipping Restrictions: | This product may require additional documentation to export from the United States. | This product may require additional documentation to export from the United States. |
RoHS: | N | - |
Number of Logic Elements: | 11000 LE | 11000 LE |
Number of I/Os: | 177 I/O | 177 I/O |
Minimum Operating Temperature: | 0 C | 0 C |
Maximum Operating Temperature: | + 70 C | + 85 C |
Mounting Styles: | SMD/SMT | SMD/SMT |
Maximum Operating Frequency: | 250 MHz | 350 MHz |
Moisture Sensitive: | Yes | - |
Factory Pack QuantityFactory Pack Quantity: | 90 | 90 |
Tradename: | IGLOOe | ProASIC3 |
Package: | Tray | Tray |
Base Product Number: | M1AGL1000 | A3P1000 |
Mfr: | Microchip Technology | Microchip Technology |
Product Status: | Active | Active |
Package Description: | BGA, | - |
Package Style: | GRID ARRAY | - |
Moisture Sensitivity Levels: | 3 | - |
Package Body Material: | PLASTIC/EPOXY | - |
Supply Voltage-Nom: | 1.5 V | - |
Reflow Temperature-Max (s): | 30 | - |
Supply Voltage-Min: | 1.425 V | 1.5 V |
Operating Temperature-Max: | 85 °C | - |
Rohs Code: | No | - |
Manufacturer Part Number: | M1AGL1000V5-FG256 | - |
Clock Frequency-Max: | 108 MHz | - |
Package Code: | BGA | - |
Package Shape: | SQUARE | - |
Part Life Cycle Code: | Active | - |
Ihs Manufacturer: | MICROSEMI CORP | - |
Supply Voltage-Max: | 1.575 V | 1.5 V |
Risk Rank: | 5.3 | - |
Series: | M1AGL1000V5 | A3P1000 |
Packaging: | Tray | Tray |
Operating Temperature: | 0°C ~ 70°C (TA) | -55°C ~ 125°C (TJ) |
Terminal Finish: | TIN LEAD/TIN LEAD SILVER | - |
Max Operating Temperature: | 70 °C | - |
Min Operating Temperature: | 0 °C | - |
HTS Code: | 8542.39.00.01 | - |
Technology: | CMOS | - |
Voltage - Supply: | 1.425V ~ 1.575V | 1.14V ~ 1.575V |
Terminal Position: | BOTTOM | - |
Terminal Form: | BALL | - |
Peak Reflow Temperature (Cel): | 225 | - |
Terminal Pitch: | 1 mm | - |
Reach Compliance Code: | compliant | - |
JESD-30 Code: | S-PBGA-B256 | - |
Qualification Status: | Not Qualified | - |
Temperature Grade: | OTHER | - |
Operating Supply Current: | 127 uA | 8 mA |
RAM Size: | 18 kB | - |
Organization: | 24576 CLBS, 1000000 GATES | - |
Seated Height-Max: | 1.8 mm | - |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY | - |
Number of Logic Elements/Cells: | 24576 | - |
Total RAM Bits: | 147456 | 147456 |
Number of Gates: | 1000000 | 1000000 |
Max Frequency: | 250 MHz | - |
Number of CLBs: | 24576 | - |
Number of Equivalent Gates: | 1000000 | - |
Width: | 17 mm | - |
Length: | 17 mm | - |
Distributed RAM: | - | 144 kbit |
Embedded Block RAM - EBR: | - | 144 kbit |
Number of Logic Array Blocks - LABs: | - | - |
Total Memory: | - | 1 kbit |
Operating Supply Voltage: | - | 1.5 V |
Data Rate: | - | 700 Mb/s |
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