M2GL090-FGG676 alternative parts: A54SX72A-FFG256
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Mfr.'s Part #: | ||
Manufacturer: | ||
Category: | ||
Datasheet: | - | - |
Inventory count: | 1983 | 2051 |
Pricing(USD): | please inquire | please inquire |
Description: | FPGA - Field Programmable Gate Array M2GL090-FGG676 | FPGA - Field Programmable Gate Array A54SX72A-FFG256 |
Rohs: | ||
Lifecycle Status: | Production (Last Updated: 2 months ago) | - |
Package / Case: | FPBGA-676 | FBGA |
Mounting Type: | Surface Mount | Surface Mount |
Surface Mount: | YES | YES |
Supplier Device Package: | 676-FBGA (27x27) | 256-FPBGA (17x17) |
Number of Terminals: | 676 | 256 |
Shipping Restrictions: | This product may require additional documentation to export from the United States. | - |
RoHS: | Details | N |
Number of Logic Elements: | 86184 LE | - |
Number of I/Os: | 425 I/O | 203 I/O |
Supply Voltage-Min: | 1.2 V | 2.25 V |
Minimum Operating Temperature: | 0 C | 0 C |
Maximum Operating Temperature: | + 85 C | + 70 C |
Mounting Styles: | SMD/SMT | SMD/SMT |
Moisture Sensitive: | Yes | Yes |
Factory Pack QuantityFactory Pack Quantity: | 40 | 90 |
Tradename: | IGLOO2 | Actel |
Package: | Tray | Tray |
Base Product Number: | M2GL090 | A54SX72 |
Mfr: | Microchip Technology | Microchip Technology |
Product Status: | Active | Active |
Supply Voltage-Max: | 1.2 V | 2.75 V |
Package Description: | BGA, BGA676,26X26,40 | BGA, BGA256,16X16,40 |
Package Style: | GRID ARRAY | GRID ARRAY |
Moisture Sensitivity Levels: | 3 | 3 |
Package Body Material: | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Equivalence Code: | BGA676,26X26,40 | BGA256,16X16,40 |
Supply Voltage-Nom: | 1.2 V | 2.5 V |
Reflow Temperature-Max (s): | 30 | 30 |
Operating Temperature-Max: | 85 °C | 70 °C |
Rohs Code: | Yes | No |
Manufacturer Part Number: | M2GL090-FGG676 | A54SX72A-FFG256 |
Package Code: | BGA | BGA |
Package Shape: | SQUARE | SQUARE |
Part Life Cycle Code: | Active | Active |
Ihs Manufacturer: | MICROSEMI CORP | MICROSEMI CORP |
Risk Rank: | 5.27 | 5.24 |
Series: | M2GL090 | A54SX72A |
Packaging: | Tray | Tray |
Operating Temperature: | 0°C ~ 85°C (TJ) | 0°C ~ 70°C (TA) |
Max Operating Temperature: | 85 °C | - |
Min Operating Temperature: | 0 °C | - |
HTS Code: | 8542.39.00.01 | 8542.39.00.01 |
Technology: | CMOS | CMOS |
Voltage - Supply: | 1.2 V | 2.5 V |
Terminal Position: | BOTTOM | BOTTOM |
Terminal Form: | BALL | BALL |
Peak Reflow Temperature (Cel): | 260 | 225 |
Terminal Pitch: | 1 mm | 1 mm |
Reach Compliance Code: | compliant | unknown |
JESD-30 Code: | S-PBGA-B676 | S-PBGA-B256 |
Number of Outputs: | 425 | 203 |
Qualification Status: | Not Qualified | Not Qualified |
Power Supplies: | 1.2 V | 2.5,3.3/5 V |
Temperature Grade: | OTHER | COMMERCIAL |
RAM Size: | 323.3 kB | - |
Number of Inputs: | 425 | 203 |
Seated Height-Max: | 2.44 mm | 1.97 mm |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells: | 86316 | - |
Total RAM Bits: | 2648064 | - |
Number of Logic Cells: | 86316 | 6036 |
Width: | 27 mm | 17 mm |
Length: | 27 mm | 17 mm |
Maximum Operating Frequency: | - | 156 MHz |
Unit Weight: | - | 0.014110 oz |
Clock Frequency-Max: | - | 156 MHz |
JESD-609 Code: | - | e0 |
Terminal Finish: | - | TIN LEAD/TIN LEAD SILVER |
Additional Feature: | - | 72000 TYPICAL GATES AVAILABLE |
Organization: | - | 6036 CLBS, 108000 GATES |
Number of Gates: | - | 108000 |
Number of LABs/CLBs: | - | 6036 |
Combinatorial Delay of a CLB-Max: | - | 2 ns |
Number of CLBs: | - | 6036 |
Number of Equivalent Gates: | - | 108000 |
Height: | - | 1.2 mm |
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