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GSI Technology GS8161Z32DD-375I
GS8161Z32DD-375I
BIHD-GS8161Z32DD-375I
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ZBT SRAM, 512KX32, 4.2ns, CMOS, PBGA165, FPBGA-165
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Technical Specifications
- TypeParameterSelect All
Factory Lead Time
10 Weeks
Surface Mount
YES
Number of Terminals
165
Maximum Clock Rate
238@Flow-Through/375@Pipelined MHz
Supplier Package
FBGA
Data Rate Architecture
SDR
Typical Operating Supply Voltage
2.5, 3.3 V
Minimum Operating Supply Voltage
2.3, 3 V
Timing Type
Synchronous
Number of Words
512 kWords
Number of I/O Lines
32 Bit
Maximum Operating Supply Voltage
2.7, 3.6 V
Mounting
Surface Mount
Package Description
LBGA,
Package Style
GRID ARRAY, LOW PROFILE
Number of Words Code
512000
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
NOT SPECIFIED
Access Time-Max
4.2 ns
Operating Temperature-Max
85 °C
Rohs Code
No
Manufacturer Part Number
GS8161Z32DD-375I
Supply Voltage-Nom (Vsup)
2.5 V
Package Code
LBGA
Package Shape
RECTANGULAR
Manufacturer
GSI Technology
Part Life Cycle Code
Active
Ihs Manufacturer
GSI TECHNOLOGY
Risk Rank
5.3
Part Package Code
BGA
Usage Level
Industrial grade
Operating Temperature
ECCN Code
Additional Feature
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
HTS Code
8542.32.00.41
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Terminal Pitch
1 mm
Reach Compliance Code
compliant
Pin Count
165
JESD-30 Code
R-PBGA-B165
Supply Voltage-Max (Vsup)
2.7 V
Temperature Grade
INDUSTRIAL
Supply Voltage-Min (Vsup)
2.3 V
Number of Ports
4
Operating Mode
SYNCHRONOUS
Architecture
Flow-Through/Pipelined
Organization
512KX32
Seated Height-Max
1.4 mm
Memory Width
32
Address Bus Width
19 Bit
Density
18 Mbit
Memory Density
16777216 bit
Screening Level
Industrial
Parallel/Serial
PARALLEL
Memory IC Type
ZBT SRAM
Width
13 mm
Length
15 mm
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